The present disclosure relates to a MEMS package with a rough metal anti-stiction layer, to improve stiction characteristics, and an associated method of formation. In some embodiments, the MEMS package includes a MEMS IC bonded to a CMOS IC. The CMOS IC has a CMOS substrate and an interconnect structure disposed over the CMOS substrate. The interconnect structure includes a plurality of metal layers disposed within a plurality of dielectric layers. The MEMS IC is bonded to an upper surface of the interconnect structure and, in cooperation with the CMOS IC, enclosing a cavity between the MEMS IC and the CMOS IC. The MEMS IC has a moveable mass arranged in the cavity. The MEMS package further includes an anti-stiction layer disposed on the upper surface of the interconnect structure under the moveable mass. The anti-stiction layer is made of metal and has a rough top surface.