- 专利标题: Methods of forming capacitors
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申请号: US14877677申请日: 2015-10-07
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公开(公告)号: US09887083B2公开(公告)日: 2018-02-06
- 发明人: Vassil N. Antonov , Vishwanath Bhat
- 申请人: Micron Technology, Inc.
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Wells St. John P.S.
- 主分类号: H01G4/00
- IPC分类号: H01G4/00 ; H01G5/00 ; H01G7/00 ; H01G9/00 ; H01G13/00 ; C23F1/00 ; C23F3/00 ; H01L21/02 ; H01L21/3105 ; H01L49/02
摘要:
A method of forming a capacitor includes depositing a dielectric metal oxide layer of a first phase to a thickness no greater than 75 Angstroms over an inner conductive capacitor electrode material. The first phase dielectric metal oxide layer has a k of at least 15. Conductive RuO2 is deposited over and into physical contact with the dielectric metal oxide layer. Then, the RuO2 and the dielectric metal oxide layer are annealed at a temperature below 500° C. The RuO2 in physical contact with the dielectric metal oxide during the annealing facilitates a change of the dielectric metal oxide layer from the first phase to a second crystalline phase having a higher k than the first phase. The annealed dielectric metal oxide layer is incorporated into a capacitor dielectric region of a capacitor construction. Other implementations are disclosed.
公开/授权文献
- US20160027642A1 Methods of Forming Capacitors 公开/授权日:2016-01-28
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