Invention Grant
- Patent Title: Method for producing an optoelectronic component, and optoelectronic component
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Application No.: US15508868Application Date: 2015-08-26
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Publication No.: US09899574B2Publication Date: 2018-02-20
- Inventor: Markus Pindl , Juergen Moosburger
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductor GmbH
- Current Assignee: OSRAM Opto Semiconductor GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE102014112818 20140905
- International Application: PCT/EP2015/069534 WO 20150826
- International Announcement: WO2016/034472 WO 20160310
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/48 ; H01L33/54 ; H01L33/60 ; H01L33/62
Abstract:
A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment, the method includes arranging an optoelectronic semiconductor chip and a reflector on a top side of a carrier film, arranging a potting material in a region between the optoelectronic semiconductor chip and the reflector and forming a molded body, wherein the optoelectronic semiconductor chip, the reflector and the potting material are embedded into the molded body.
Public/Granted literature
- US20170263825A1 Method for Producing an Optoelectronic Component, and Optoelectronic Component Public/Granted day:2017-09-14
Information query
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