公开(公告)号：US20200075818A1

公开(公告)日：2020-03-05

申请号：US16491146

申请日：2018-03-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Markus Burger ,  Markus Boss ,  Matthias Lermer

IPC: H01L33/54 ,  H01L33/56 ,  H01L33/50

Abstract: A method for producing at at least an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a substrate having at least one aperture, applying at least one semiconductor chip to the substrate, arranging barrier structures provided that the barrier structures are not already part of the substrate, wherein the semiconductor chip is spaced apart from the barrier structures as seen in a side cross-section, applying an auxiliary carrier at least to a main radiation exit surface and to the barrier structures, introducing a casting material via the at least one aperture in the substrate so that the casting material is arranged between the barrier structures and the semiconductor chip and between the substrate and the auxiliary carrier, and curing the casting material.

公开(公告)号：US20200028038A1

公开(公告)日：2020-01-23

申请号：US16490944

申请日：2018-03-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Brandl ,  Markus Pindl

IPC: H01L33/54 ,  H01L33/48 ,  H01L33/58 ,  H01L33/56

Abstract: A light-emitting component includes a light-emitting element and a housing with a cavity. The housing includes a housing material that absorbs at least 80 percent of light in the visible range. The cavity is formed by a limiting wall, formed by a housing surface, and a plane of the element. The light-emitting element arranged within the cavity of the housing and positioned above the element plane includes an emission side located opposite to the element plane. The cavity is at least partially filled with a transparent material composed of a first material and a second material, wherein the first material at least partially covers the limiting wall, and the second material at least partially covers the emission side. A boundary surface is formed between the first material and the second material. A first refractive index of the first material is smaller than a second refractive index of the second material.

公开(公告)号：US20190334312A1

公开(公告)日：2019-10-31

申请号：US16471731

申请日：2018-03-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Bernhard Stich ,  Andreas Wojcik

IPC: H01S5/022 ,  H05K1/18 ,  H01S5/06

Abstract: A device having a reinforcement layer and a method for producing a device are disclosed. In an embodiment a device includes a carrier plate, an electronic component, a shaped body and a reinforcement layer, wherein the electronic component is laterally enclosed by the shaped body, wherein, in a vertical direction, the electronic component is arranged between the carrier plate and the reinforcement layer, wherein the shaped body has a thermal expansion coefficient which is at least three times as large as a thermal expansion coefficient of the carrier plate and at least three times as large as a thermal expansion coefficient of the reinforcement layer, and wherein the carrier plate and the reinforcement layer adjoin the shaped body at least in places and are configured to reduce deformation of the shaped body in an event of temperature fluctuations.

公开(公告)号：US20190214536A1

公开(公告)日：2019-07-11

申请号：US16315319

申请日：2017-07-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Markus Pindl

IPC: H01L33/60 ,  H01L33/56 ,  H01L33/00 ,  H01L33/48 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A method of producing an optoelectronic component includes providing a carrier; arranging a structured reflector above a top side of the carrier; arranging an optoelectronic semiconductor chip including a top side and an underside opposite the top side in an opening of the reflector, wherein the underside of the optoelectronic semiconductor chip faces the top side of the carrier; arranging an embedding material above the top side of the carrier, wherein the optoelectronic semiconductor chip is at least partly embedded into the embedding material, as a result of which a composite body including the optoelectronic semiconductor chip, the reflector and the embedding material is formed; and detaching the composite body from the carrier.

公开(公告)号：US20160240747A1

公开(公告)日：2016-08-18

申请号：US15027482

申请日：2014-10-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Martin Brandl

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/58 ,  H01L33/48 ,  H01L33/56

CPC classification number: H01L33/502 ,  H01L27/15 ,  H01L33/0095 ,  H01L33/483 ,  H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0083 ,  H01L2924/00014

Abstract: An optoelectronic component includes a housing body, wherein a cavity is formed on the upper side of the housing body, and a channel extending from the cavity to an outer edge of the upper side of the housing body is formed on the upper side of the housing body; and a method of producing an optoelectronic component including providing a flat panel of a multiplicity of housing bodies, each housing body having a cavity opening onto an upper side of the panel wherein the cavities of neighboring housing bodies connect by channels and open onto the upper side of the panel, arranging an encapsulation material in the cavities of the housing bodies, and dividing the panel.

Abstract translation: 光电子部件包括壳体，其中腔体形成在壳体的上侧上，并且从腔体延伸到壳体主体上侧的外边缘的通道形成在壳体的上侧 身体; 以及一种制造光电子部件的方法，包括提供多个壳体的平板，每个壳体具有通向所述面板的上侧的空腔，其中相邻的壳体的空腔通过通道连接并向上开放 在壳体的空腔中布置封装材料，并分割面板。

公开(公告)号：US11107958B2

公开(公告)日：2021-08-31

申请号：US16489393

申请日：2018-03-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Markus Burger ,  Markus Boß ,  Markus Pindl

IPC: H01L33/54 ,  H01L25/075 ,  H01L33/62

Abstract: A method of producing optoelectronic semiconductor components includes A) providing a chip carrier with electrical conductor structures on a carrier upper side, B) applying at least one semi-conductor chip configured to produce light on at least one of the electrical conductor structures, C) applying at least one sealing structure to at least one of the electrical conductor structures so that the sealing structure completely surrounds at least one contact area when viewed from the top, and D) producing a mold body directly at the at least one semiconductor chip and directly at the at least one sealing structure by transfer molding or injection molding, wherein, in an injection mold, the at least one sealing structure seals the at least one contact area against a material of the mold body so that the at least one contact area remains free of the mold body.

公开(公告)号：US10910789B2

公开(公告)日：2021-02-02

申请号：US16471731

申请日：2018-03-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Bernhard Stich ,  Andreas Wojcik

IPC: H05K7/00 ,  H01S5/02208 ,  H01S5/022 ,  H01S5/06 ,  H05K1/18

Abstract: A device having a reinforcement layer and a method for producing a device are disclosed. In an embodiment a device includes a carrier plate, an electronic component, a shaped body and a reinforcement layer, wherein the electronic component is laterally enclosed by the shaped body, wherein, in a vertical direction, the electronic component is arranged between the carrier plate and the reinforcement layer, wherein the shaped body has a thermal expansion coefficient which is at least three times as large as a thermal expansion coefficient of the carrier plate and at least three times as large as a thermal expansion coefficient of the reinforcement layer, and wherein the carrier plate and the reinforcement layer adjoin the shaped body at least in places and are configured to reduce deformation of the shaped body in an event of temperature fluctuations.

公开(公告)号：US20180308894A1

公开(公告)日：2018-10-25

申请号：US15959425

申请日：2018-04-23

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Burger ,  Markus Pindl ,  Markus Boss

IPC: H01L27/146 ,  G02B6/42 ,  G02B6/43 ,  G02B7/02

CPC classification number: H01L27/14685 ,  G02B6/4206 ,  G02B6/43 ,  G02B7/025 ,  H01L27/14627

Abstract: A method of producing an optoelectronic device includes providing an optical element including an optical lens and including a frame, wherein the frame projects with a receptacle section beyond a first side of the lens, the receptacle section of the frame surrounds a receptacle space, and the receptacle section of the frame includes a bearing face at an inner side; inserting an optoelectronic component and a transparent intermediate element into the receptacle space; placing the intermediate element onto the bearing face; and securing the component and the intermediate element to the frame.

公开(公告)号：US09899574B2

公开(公告)日：2018-02-20

申请号：US15508868

申请日：2015-08-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Juergen Moosburger

IPC: H01L21/00 ,  H01L33/48 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L21/568 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/2518 ,  H01L2224/96 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment, the method includes arranging an optoelectronic semiconductor chip and a reflector on a top side of a carrier film, arranging a potting material in a region between the optoelectronic semiconductor chip and the reflector and forming a molded body, wherein the optoelectronic semiconductor chip, the reflector and the potting material are embedded into the molded body.

公开(公告)号：US20180033925A1

公开(公告)日：2018-02-01

申请号：US15550968

申请日：2016-02-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Siegfried Herrmann ,  Kathy Schmidtke

IPC: H01L33/50 ,  H01L33/48 ,  H01L33/00 ,  H01L33/54 ,  H01L33/58

CPC classification number: H01L33/508 ,  H01L33/005 ,  H01L33/486 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A method of producing a light-emitting device includes providing a carrier having a carrier top face and at least one light-emitting semiconductor chip arranged on the carrier top face, wherein the semiconductor chip has a radiation emission face and is arranged on the carrier top face such that the radiation emission face faces away from the carrier top face; arranging a converter element on the at least one semiconductor chip on its radiation emission face so that the converter element fully covers the radiation emission face of the semiconductor chip and extends laterally beyond the semiconductor chip; covering the converter element with an encapsulant, and compression molding and curing the encapsulant so that the encapsulant covers the converter element on a face facing away from the semiconductor chip, and the converter element and the encapsulant fit closely against the radiation emission face and at least against a side face of the semiconductor chip; and detaching the encapsulant, together with the converter element and the semiconductor chip, from the carrier.