- 专利标题： Supporting unit and substrate treating apparatus including the same
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申请号： US14974023申请日： 2015-12-18
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公开(公告)号： US09909197B2公开(公告)日： 2018-03-06
- 发明人: Wonhaeng Lee , Kang Rae Ha
- 申请人： Semes Co., Ltd.
- 申请人地址： KR Chungcheongnam-do
- 专利权人： SEMES CO., LTD.
- 当前专利权人： SEMES CO., LTD.
- 当前专利权人地址： KR Chungcheongnam-do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR10-2014-0186104 20141222; KR10-2015-0137803 20150930
- 主分类号： B23K31/02
- IPC分类号： B23K31/02 ; C22C29/12 ; H02N13/00 ; B23K35/32 ; B23K35/28 ; C22C29/02 ; H01J37/32 ; H01L21/67 ; H01L21/683 ; H01L21/687 ; B32B15/00 ; C22C49/06 ; C22C49/14
摘要：
A fabrication method of a supporting unit supporting a substrate is provided. The fabrication method includes providing a supporting plate that is made of a non-conductive material and configured to support the substrate, providing a base plate that is disposed under the supporting plate and made of a material containing a conductive material, and forming a first metal film on a top surface of the base plate and bonding the supporting plate with the base plate through a brazing process.
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