Invention Grant
- Patent Title: Heat treatment apparatus and method of controlling the same
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Application No.: US13742599Application Date: 2013-01-16
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Publication No.: US09909809B2Publication Date: 2018-03-06
- Inventor: Goro Takahashi , Takanori Saito , Wenling Wang , Koji Yoshii , Tatsuya Yamaguchi
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Cantor Colburn LLP
- Priority: JP2012-011203 20120123
- Main IPC: A21B1/22
- IPC: A21B1/22 ; H05B1/02 ; A21B1/00 ; F27D19/00 ; F27D21/00 ; F27B17/00 ; H01L21/67

Abstract:
The heat treatment apparatus includes: a processing chamber which accommodates a processing object; a heating unit which heats the processing object accommodated in the processing chamber; a temperature detecting unit which detects an internal temperature of the processing chamber; and a controller which sets a second setting temperature identical to as a temperature detected by the temperature detecting unit when the temperature detected by the temperature detecting unit falls below a predetermined first setting temperature due to an external disturbance; controls the heating unit so that a third setting temperature between the second setting temperature and the first setting temperature becomes identical to the temperature detected by the temperature detecting unit; and controls the heating unit so that the first setting temperature becomes identical to the temperature detected by the temperature detecting unit after the third setting temperature becomes identical to the temperature detected by the temperature detecting unit.
Public/Granted literature
- US20130186878A1 HEAT TREATMENT APPARATUS AND METHOD OF CONTROLLING THE SAME Public/Granted day:2013-07-25
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