发明授权
- 专利标题: Semiconductor device including source/drain contact having height below gate stack
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申请号: US15331363申请日: 2016-10-21
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公开(公告)号: US09917050B2公开(公告)日: 2018-03-13
- 发明人: Chih-Liang Chen , Chih-Ming Lai , Kam-Tou Sio , Ru-Gun Liu , Meng-Hung Shen , Chun-Hung Liou , Shu-Hui Sung , Charles Chew-Yuen Young
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsin-Chu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Haynes and Boone, LLP
- 主分类号: G01R31/26
- IPC分类号: G01R31/26 ; H01L23/522 ; H01L21/768 ; H01L23/535 ; H01L23/48 ; H01L21/8234 ; H01L23/528 ; H01L23/532 ; H01L27/088 ; H01L29/40 ; H01L29/423 ; H01L29/45 ; H01L29/66
摘要:
A semiconductor device includes a substrate having source and drain regions, and a channel region arranged between the source and drain regions. The device further includes a gate structure over the substrate and adjacent to the channel region. The gate structure includes a gate stack, a spacer on sidewalls of the gate stack, and a conductor over the gate stack. The device further includes a first contact feature over the substrate and electrically connecting to at least one of the source and drain regions. A top surface of the first contact feature is lower than a top surface of the gate structure. The device further includes a first dielectric layer over the first contact feature. A top surface of the first dielectric layer is below or substantially co-planar with the top surface of the gate structure. The conductor at most partially overlaps in plan view with the first dielectric layer.
公开/授权文献
- US20170040259A1 Structure And Method For Semiconductor Device 公开/授权日:2017-02-09
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