- 专利标题: Semiconductor device
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申请号: US15293448申请日: 2016-10-14
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公开(公告)号: US09925568B2公开(公告)日: 2018-03-27
- 发明人: Seung Yeon Lee , Jun Ho Lee , Kyungsang Cho , Young Suk Jung
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Gyeonggi-Do
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Gyeonggi-Do
- 代理机构: Cantor Colburn LLP
- 优先权: KR10-2013-0148745 20131202; KR10-2014-0167145 20141127
- 主分类号: H01L33/06
- IPC分类号: H01L33/06 ; B08B3/08 ; B05D1/02 ; C01B19/00 ; B22F1/00 ; B08B3/10 ; C09K11/02 ; C09K11/56 ; C09K11/88 ; B82Y20/00
摘要:
A method for removing an organic ligand from a surface of a particle including: obtaining a particle having an organic ligand disposed on a surface thereof; contacting the particle with an alkylammonium salt represented by Chemical Formula 1: NR′4+A− Chemical Formula 1 wherein groups R′ are the same or different and are each independently hydrogen or a C1 to C20 alkyl group, provided that at least one group R′ is an alkyl group, and A is a hydroxide anion, a halide anion, a borohydride anion, a nitrate anion, a phosphate anion, or a sulfate anion; and heat-treating the particle to carry out a reaction between the alkylammonium salt and the organic ligand.
公开/授权文献
- US20170028448A1 METHODS OF REMOVING SURFACE LIGAND COMPOUNDS 公开/授权日:2017-02-02
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