Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15293448Application Date: 2016-10-14
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Publication No.: US09925568B2Publication Date: 2018-03-27
- Inventor: Seung Yeon Lee , Jun Ho Lee , Kyungsang Cho , Young Suk Jung
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Cantor Colburn LLP
- Priority: KR10-2013-0148745 20131202; KR10-2014-0167145 20141127
- Main IPC: H01L33/06
- IPC: H01L33/06 ; B08B3/08 ; B05D1/02 ; C01B19/00 ; B22F1/00 ; B08B3/10 ; C09K11/02 ; C09K11/56 ; C09K11/88 ; B82Y20/00

Abstract:
A method for removing an organic ligand from a surface of a particle including: obtaining a particle having an organic ligand disposed on a surface thereof; contacting the particle with an alkylammonium salt represented by Chemical Formula 1: NR′4+A− Chemical Formula 1 wherein groups R′ are the same or different and are each independently hydrogen or a C1 to C20 alkyl group, provided that at least one group R′ is an alkyl group, and A is a hydroxide anion, a halide anion, a borohydride anion, a nitrate anion, a phosphate anion, or a sulfate anion; and heat-treating the particle to carry out a reaction between the alkylammonium salt and the organic ligand.
Public/Granted literature
- US20170028448A1 METHODS OF REMOVING SURFACE LIGAND COMPOUNDS Public/Granted day:2017-02-02
Information query
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