- Patent Title: Conductive pattern and integrated fan-out package having the same
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Application No.: US15281043Application Date: 2016-09-29
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Publication No.: US09941216B2Publication Date: 2018-04-10
- Inventor: Ming-Yen Chiu , Ching-Fu Chang , Chien-Chia Chiu , Hsin-Chieh Huang , Tsung-Shu Lin , Pei-Ti Yu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L25/10
Abstract:
A conductive pattern including a teardrop shaped portion, a routing line, and a connection portion is provided. The routing line links to the teardrop shaped portion through the connection portion, and a width of the connection portion decreases along an extending direction from the teardrop shaped portion to the routing line. Furthermore, an integrated fan-out package including the above-mentioned conductive pattern is also provided.
Public/Granted literature
- US20170345762A1 CONDUCTIVE PATTERN AND INTEGRATED FAN-OUT PACKAGE HAVING THE SAME Public/Granted day:2017-11-30
Information query
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