公开(公告)号：US20190252323A1

公开(公告)日：2019-08-15

申请号：US16396794

申请日：2019-04-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L23/538 ,  H01L23/31 ,  H01L49/02 ,  H01L21/683 ,  H01L23/66

Abstract: An integrated fan-out package including an integrated circuit, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit includes an antenna region. The insulating encapsulation encapsulates the integrated circuit. The redistribution circuit structure is disposed on the integrated circuit and the insulating encapsulation. The redistribution circuit structure is electrically connected to the integrated circuit, and the redistribution circuit structure includes a redistribution region and a dummy region including a plurality of dummy patterns embedded therein, wherein the antenna region includes an inductor and a wiring-free dielectric portion, and the wiring-free dielectric portion of the antenna region is between the inductor and the dummy region.

公开(公告)号：US10276506B2

公开(公告)日：2019-04-30

申请号：US15215594

申请日：2016-07-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L23/538 ,  H01L49/02 ,  H01L23/66 ,  H01L23/31

Abstract: A semiconductor device including an integrated circuit, a protection layer, and a conductive via is provided. The integrated circuit includes at least one conductive pad. The protection layer covers the integrated circuit. The protection layer includes a contact opening, and the conductive pad is exposed by the contact opening of the protection layer. The conductive via is embedded in the contact opening of the protection layer, and the conductive via is electrically connected to the conductive pad through the contact opening. A method of fabricating the above-mentioned semiconductor device and an integrated fan-out package including the above-mentioned semiconductor device are also provided.

公开(公告)号：US10037961B2

公开(公告)日：2018-07-31

申请号：US15156339

申请日：2016-05-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L23/00 ,  H01L23/48 ,  H01L23/544 ,  H01L23/31 ,  H01L21/768 ,  H01L21/56 ,  H01L21/3105 ,  H01L21/683 ,  H01L25/065 ,  H01L21/78

CPC classification number: H01L24/14 ,  H01L21/31053 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76885 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3192 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/06 ,  H01L24/20 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/059 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2924/14 ,  H01L2224/03 ,  H01L2924/014

Abstract: An integrated fan-out package including an integrated circuit, an insulating encapsulation, a plurality of conductive through vias, and a redistribution circuit structure is provided. The integrated circuit includes a plurality of conductive terminals. The insulating encapsulation encapsulates sidewalls of the integrated circuit. The conductive through vias penetrate in the insulating encapsulation. The redistribution circuit structure is disposed on the integrated circuit, the conductive through vias and the insulating encapsulation. The redistribution conductive layer is electrically connected to the conductive terminals and the conductive through vias. A plurality of first contact surfaces of the conductive terminals and a plurality of second contact surfaces of the conductive through vias are in contact with the redistribution circuit structure, and a roughness of the first contact surfaces and the second contact surfaces ranges from 100 angstroms to 500 angstroms. Methods of fabricating the integrated fan-out package are also provided.

公开(公告)号：US09941216B2

公开(公告)日：2018-04-10

申请号：US15281043

申请日：2016-09-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Chien-Chia Chiu ,  Hsin-Chieh Huang ,  Tsung-Shu Lin ,  Pei-Ti Yu

IPC: H01L23/538 ,  H01L25/10

CPC classification number: H01L23/5386 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/568 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311

Abstract: A conductive pattern including a teardrop shaped portion, a routing line, and a connection portion is provided. The routing line links to the teardrop shaped portion through the connection portion, and a width of the connection portion decreases along an extending direction from the teardrop shaped portion to the routing line. Furthermore, an integrated fan-out package including the above-mentioned conductive pattern is also provided.

公开(公告)号：US20200373245A1

公开(公告)日：2020-11-26

申请号：US16989892

申请日：2020-08-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L23/538 ,  H01L49/02 ,  H01L23/66 ,  H01L23/31 ,  H01L21/683

Abstract: An integrated fan-out package including an integrated circuit, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit includes an antenna region. The insulating encapsulation encapsulates the integrated circuit. The redistribution circuit structure is disposed on the integrated circuit and the insulating encapsulation. The redistribution circuit structure is electrically connected to the integrated circuit, and the redistribution circuit structure includes a redistribution region and a dummy region including a plurality of dummy patterns embedded therein, wherein the antenna region includes an inductor and a wiring-free dielectric portion, and the wiring-free dielectric portion of the antenna region is between the inductor and the dummy region.

公开(公告)号：US10790235B2

公开(公告)日：2020-09-29

申请号：US16234620

申请日：2018-12-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L25/10 ,  H01L25/00 ,  H01L23/498

Abstract: An integrated fan-out package including a die attach film, an integrated circuit component, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit component is disposed on the die attach film and includes a plurality of conductive terminals. The die attach film includes an uplifted edge which raises toward sidewalls of the integrated circuit component. The insulating encapsulation encapsulates the uplifted edge and the integrated circuit component. The redistribution circuit structure is disposed on the integrated circuit component and the insulating encapsulation, and the redistribution circuit structure is electrically connected to the conductive terminals of the integrated circuit component. A method of fabricating the integrated fan-out package are also provided.

公开(公告)号：US20180096942A1

公开(公告)日：2018-04-05

申请号：US15794006

申请日：2017-10-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L23/538 ,  H01L25/00 ,  H01L25/10 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: An integrated fan-out package including a die attach film, an integrated circuit component, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit component is disposed on the die attach film and includes a plurality of conductive terminals. The die attach film includes an uplifted edge which raises toward sidewalls of the integrated circuit component. The insulating encapsulation encapsulates the uplifted edge and the integrated circuit component. The redistribution circuit structure is disposed on the integrated circuit component and the insulating encapsulation, and the redistribution circuit structure is electrically connected to the conductive terminals of the integrated circuit component. A method of fabricating the integrated fan-out package are also provided.

公开(公告)号：US09837359B1

公开(公告)日：2017-12-05

申请号：US15281081

申请日：2016-09-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L21/56 ,  H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L25/10 ,  H01L25/00

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: An integrated fan-out package including a die attach film, an integrated circuit component, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit component is disposed on the die attach film and includes a plurality of conductive terminals. The die attach film includes an uplifted edge which raises toward sidewalls of the integrated circuit component. The insulating encapsulation encapsulates the uplifted edge and the integrated circuit component. The redistribution circuit structure is disposed on the integrated circuit component and the insulating encapsulation, and the redistribution circuit structure is electrically connected to the conductive terminals of the integrated circuit component. A method of fabricating the integrated fan-out package are also provided.

公开(公告)号：US11362037B2

公开(公告)日：2022-06-14

申请号：US16989892

申请日：2020-08-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L23/538 ,  H01L49/02 ,  H01L23/66 ,  H01L23/31 ,  H01L21/683 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00

Abstract: An integrated fan-out package including an integrated circuit, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit includes an antenna region. The insulating encapsulation encapsulates the integrated circuit. The redistribution circuit structure is disposed on the integrated circuit and the insulating encapsulation. The redistribution circuit structure is electrically connected to the integrated circuit, and the redistribution circuit structure includes a redistribution region and a dummy region including a plurality of dummy patterns embedded therein, wherein the antenna region includes an inductor and a wiring-free dielectric portion, and the wiring-free dielectric portion of the antenna region is between the inductor and the dummy region.

公开(公告)号：US10770402B2

公开(公告)日：2020-09-08

申请号：US16396794

申请日：2019-04-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Yen Chiu ,  Ching-Fu Chang ,  Hsin-Chieh Huang

IPC: H01L23/538 ,  H01L49/02 ,  H01L23/66 ,  H01L23/31 ,  H01L21/683 ,  H01L21/56 ,  H01L23/498

Abstract: An integrated fan-out package including an integrated circuit, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit includes an antenna region. The insulating encapsulation encapsulates the integrated circuit. The redistribution circuit structure is disposed on the integrated circuit and the insulating encapsulation. The redistribution circuit structure is electrically connected to the integrated circuit, and the redistribution circuit structure includes a redistribution region and a dummy region including a plurality of dummy patterns embedded therein, wherein the antenna region includes an inductor and a wiring-free dielectric portion, and the wiring-free dielectric portion of the antenna region is between the inductor and the dummy region.