Invention Grant
- Patent Title: Memory device and method of manufacturing the same
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Application No.: US15288233Application Date: 2016-10-07
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Publication No.: US09941333B2Publication Date: 2018-04-10
- Inventor: Ji-hyun Jeong , Gwan-hyeob Koh , Dae-hwan Kang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2016-0020700 20160222
- Main IPC: H01L27/082
- IPC: H01L27/082 ; H01L27/24 ; H01L29/12 ; H01L45/00 ; H01L27/102 ; G11C13/00

Abstract:
A memory device includes a first electrode line layer including a plurality of first electrode lines extending on a substrate in a first direction and being spaced apart from each other, a second electrode line layer including a plurality of second electrode lines extending on the first electrode line layer in a second direction that is different from the first direction and being spaced apart from each other, and a memory cell layer including a plurality of first memory cells located at a plurality of intersections between the plurality of first electrode lines and the plurality of second electrode lines, each first memory cell including a selection device layer, an intermediate electrode and a variable resistance layer that are sequentially stacked. A side surface of the variable resistance layer is perpendicular to a top surface of the substrate or inclined to be gradually wider toward an upper portion of the variable resistance layer. The first memory cell has a side surface slope so as to have a width gradually decreasing toward its upper portion.
Public/Granted literature
- US20170243923A1 MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-08-24
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