Invention Grant
- Patent Title: Thin-film dielectric and thin-film capacitor element
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Application No.: US14738405Application Date: 2015-06-12
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Publication No.: US09947469B2Publication Date: 2018-04-17
- Inventor: Masahito Furukawa , Masanori Kosuda , Saori Takeda
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-149746 20140723; JP2015-115579 20150608
- Main IPC: C01G23/00
- IPC: C01G23/00 ; C01G25/00 ; C01G35/00 ; H01G4/30 ; H01G4/10 ; H01G4/12 ; H01G4/33 ; C23C14/08 ; C04B35/49 ; C04B35/495 ; C23C14/00 ; C23C14/28 ; C23C18/12

Abstract:
A thin-film dielectric having a higher dielectric constant than usual ones and not requiring a special single crystal substrate, and a large-capacity thin-film capacitor element using the thin-film dielectric, in which a BaTiO3-based perovskite solid solution and a KNbO3-based perovskite solid solution are alternately formed to form a crystal structure gradient region where a lattice constant continuously changes at the interface, and thus crystal lattice strain occurs, thereby permitting the production of a thin-film dielectric having a high dielectric constant; also, a large-capacity thin-film capacitor element can be produced by using the thin-film dielectric of the present invention.
Public/Granted literature
- US20160027587A1 THIN-FILM DIELECTRIC AND THIN-FILM CAPACITOR ELEMENT Public/Granted day:2016-01-28
Information query
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