Invention Grant
- Patent Title: Substrate liquid processing apparatus
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Application No.: US14580557Application Date: 2014-12-23
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Publication No.: US09953848B2Publication Date: 2018-04-24
- Inventor: Terufumi Wakiyama , Norihiro Ito , Jiro Higashijima
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2013-272204 20131227; JP2014-211908 20141016
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687

Abstract:
A substrate liquid processing apparatus of the present disclosure supplies a plurality of processing liquids from a processing liquid supplying unit in a switching manner to a substrate held on a substrate holding unit. An elevatable inner cup surrounds the substrate holding unit laterally and forms a first drain path that drains the first processing liquid. An outer cup surrounds the inner cup and forms a second drain path that drains the second processing liquid. A cover covers the outside of the outer cup, includes an eaves portion that extends inwardly from an upper side, and forms an exhaust path between the cover and the outer cup. The exhaust path is connected to the first drain path and the second drain path above inlets of the first drain path and the second drain path.
Public/Granted literature
- US20150187613A1 SUBSTRATE LIQUID PROCESSING APPARATUS Public/Granted day:2015-07-02
Information query
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