公开(公告)号：US20230001458A1

公开(公告)日：2023-01-05

申请号：US17810385

申请日：2022-07-01

Applicant: Tokyo Electron Limited

Inventor： Yusuke Hashimoto ,  Daisuke Goto ,  Kanta Mori ,  Jiro Higashijima ,  Nobuhiro Ogata

IPC: B08B3/04 ,  B05B1/10 ,  B08B3/08

Abstract: A substrate processing apparatus includes a holder configured to hold a substrate; a driving unit configured to rotate the holder; an inner cup body provided in the holder to surround the substrate held by the holder; a mist guard, surrounding the holder and the inner cup body, configured to be moved up and down; a cleaning liquid supply configured to supply a cleaning liquid; and a controller. The controller is configured to perform: supplying a processing liquid to the substrate from a processing liquid supply, in a state that the substrate is held by the holder and the mist guard is raised; and dispersing, after the supplying of the processing liquid, the cleaning liquid supplied from the cleaning liquid supply to an entire inner peripheral surface of the mist guard, in a state that the substrate is carried out from the holder and the mist guard is raised.

公开(公告)号：US11024518B2

公开(公告)日：2021-06-01

申请号：US15747921

申请日：2016-07-28

Applicant: Tokyo Electron Limited

Inventor： Norihiro Ito ,  Jiro Higashijima ,  Nobuhiro Ogata ,  Takahisa Otsuka ,  Yuichi Douki ,  Yusuke Hashimoto ,  Kazuhiro Aiura ,  Daisuke Goto

IPC: B08B3/02 ,  H01L21/67 ,  B08B17/02 ,  H01L21/687 ,  B08B3/08 ,  H01L21/02

Abstract: A substrate processing apparatus includes a stationary cup body 51 provided to surround a substrate holding unit 31 and configured to receive a processing liquid or mist of the processing liquid discharged onto a substrate, the stationary cup body not being moved relatively with respect to a processing vessel; a mist guard 80; and a guard elevating mechanism 84 configured to elevate the mist guard. Here, the mist guard is provided at an outside of the stationary cup body to surround the stationary cup body and configured to block a liquid scattered outwards beyond a space above the stationary cup body. Further, the mist guard includes a cylindrical portion 81 of a cylindrical shape and a protruding portion 82 protruded from an upper portion of the cylindrical portion toward an inside of the cylindrical portion.

公开(公告)号：US20160148827A1

公开(公告)日：2016-05-26

申请号：US14943138

申请日：2015-11-17

Applicant: Tokyo Electron Limited

Inventor： Terufumi Wakiyama ,  Norihiro Ito ,  Jiro Higashijima ,  Satoshi Biwa

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/68728 ,  H01L21/67051

Abstract: A substrate processing system includes: a holding plate provided to be rotatable around a vertical axis; a substrate holding member provided on the holding plate to hold a substrate; a rotary drive unit that rotates the substrate in a predetermined direction; and a processing fluid supply unit that supplies a processing liquid to the substrate. The substrate holding member includes a first side portion provided at a position facing the substrate and a second side portion and a third side portion that are adjacent to the first side portion. The first side portion includes a gripping portion configured to grip an end surface of the substrate. The second side portion forms a pointed end portion with the first side portion, and includes a liquid flow guide portion that guides the processing liquid to a lower side of the substrate after the processing liquid is supplied to the substrate.

Abstract translation: 一种基板处理系统，包括：保持板，设置成可围绕垂直轴线旋转; 衬底保持构件，设置在所述保持板上以保持衬底; 旋转驱动单元，其使基板沿预定方向旋转; 以及将处理液供给到基板的处理液供给单元。 衬底保持构件包括设置在面向衬底的位置处的第一侧部和与第一侧部相邻的第二侧部和第三侧部。 第一侧部分包括构造成夹持基板的端面的夹持部分。 第二侧部分形成具有第一侧部分的尖端部分，并且包括在将处理液体供应到基板之后将处理液引导到基板的下侧的液体引导部分。

公开(公告)号：US20140251539A1

公开(公告)日：2014-09-11

申请号：US14198922

申请日：2014-03-06

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Mizuno ,  Yoichi Tokunaga ,  Hiromitsu Namba ,  Tatuhiro Ueki ,  Jun Nogami ,  Jiro Higashijima ,  Yoshifumi Amano ,  Takatoshi Miyama

IPC: H01L21/67

CPC classification number: H01L21/67051

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method configured to perform a processing of a substrate by a processing liquid, in which the processing liquid is supplied to a substrate which rotates to process the substrate. The substrate processing apparatus includes a substrate rotating unit that rotates the substrate, a processing liquid supply unit that supplies the processing liquid to the substrate, a collection cup disposed around the substrate to collect the processing liquid supplied to the substrate, and form an air stream that flows downward from an opening formed at a top of the collection cup through a periphery of an outside of the substrate, and a negative pressure generating unit which is provided at an inside of the collection cup and at an outside of the opening and generates a negative pressure which acts toward the outside of the substrate.

Abstract translation: 公开了一种基板处理装置和基板处理方法，其被配置为通过处理液体进行基板的处理，其中处理液体被供给到旋转以处理基板的基板。 基板处理装置包括使基板旋转的基板旋转单元，将处理液供给到基板的处理液供给单元，设置在基板周围的收集杯，收集供给到基板的处理液，形成空气流 从形成在收集杯顶部的开口向下流过基板外部的周边;以及负压产生单元，其设置在收集杯的内部并在开口的外侧，并产生 作用于衬底外部的负压。

公开(公告)号：US12148632B2

公开(公告)日：2024-11-19

申请号：US17810385

申请日：2022-07-01

Applicant: Tokyo Electron Limited

Inventor： Yusuke Hashimoto ,  Daisuke Goto ,  Kanta Mori ,  Jiro Higashijima ,  Nobuhiro Ogata

IPC: H01L21/67 ,  B05B1/10 ,  B08B3/04 ,  B08B3/08

Abstract: A substrate processing apparatus includes a holder configured to hold a substrate; a driving unit configured to rotate the holder; an inner cup body provided in the holder to surround the substrate held by the holder; a mist guard, surrounding the holder and the inner cup body, configured to be moved up and down; a cleaning liquid supply configured to supply a cleaning liquid; and a controller. The controller is configured to perform: supplying a processing liquid to the substrate from a processing liquid supply, in a state that the substrate is held by the holder and the mist guard is raised; and dispersing, after the supplying of the processing liquid, the cleaning liquid supplied from the cleaning liquid supply to an entire inner peripheral surface of the mist guard, in a state that the substrate is carried out from the holder and the mist guard is raised.

公开(公告)号：US11158525B2

公开(公告)日：2021-10-26

申请号：US16074445

申请日：2017-01-20

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasuhiro Takaki ,  Shinichi Umeno ,  Takashi Nagai ,  Hisashi Morita ,  Nobuhiro Ogata ,  Yusuke Takamatsu ,  Jiro Higashijima

IPC: H01L21/67

Abstract: A recovery route returns, to a retaining tank, mixed solution supplied to a substrate processing unit. A discarding route discards the supplied mixed solution to a place other than the retaining tank. A switching controller causes the supplied mixed solution to flow into the discarding route during a time interval until a first time interval has elapsed from a time point when the substrate processing unit starts to supply the mixed solution; causes the supplied mixed solution to flow into the recovery route during a time interval until a second time interval, which is decided based on a predetermined recovery rate, has elapsed after the first time interval elapses; and causes the supplied mixed solution to flow into the discarding route during a time interval until supply of the mixed solution has been ended from a time point when the second time interval elapses.

公开(公告)号：US20210043467A1

公开(公告)日：2021-02-11

申请号：US16984386

申请日：2020-08-04

Applicant: Tokyo Electron Limited

Inventor： Yusuke Hashimoto ,  Jiro Higashijima

IPC: H01L21/67

Abstract: A substrate processing apparatus includes a nozzle unit. The nozzle unit includes a line and a nozzle tip provided on a tip end of the line. The line includes a first layer, a second layer and a third layer. The nozzle tip is formed of a corrosion resistant resin having conductivity. The third layer is configured to cover the first layer and the second layer from outside and cover a part of the nozzle tip from outside.

公开(公告)号：US10276425B2

公开(公告)日：2019-04-30

申请号：US14943138

申请日：2015-11-17

Applicant: Tokyo Electron Limited

Inventor： Terufumi Wakiyama ,  Norihiro Ito ,  Jiro Higashijima ,  Satoshi Biwa

IPC: H01L21/67 ,  H01L21/687

Abstract: A substrate processing system includes: a holding plate provided to be rotatable around a vertical axis; a substrate holding member provided on the holding plate to hold a substrate; a rotary drive unit that rotates the substrate in a predetermined direction; and a processing fluid supply unit that supplies a processing liquid to the substrate. The substrate holding member includes a first side portion provided at a position facing the substrate and a second side portion and a third side portion that are adjacent to the first side portion. The first side portion includes a gripping portion configured to grip an end surface of the substrate. The second side portion forms a pointed end portion with the first side portion, and includes a liquid flow guide portion that guides the processing liquid to a lower side of the substrate after the processing liquid is supplied to the substrate.

公开(公告)号：US09953848B2

公开(公告)日：2018-04-24

申请号：US14580557

申请日：2014-12-23

Applicant: Tokyo Electron Limited

Inventor： Terufumi Wakiyama ,  Norihiro Ito ,  Jiro Higashijima

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/6715 ,  H01L21/68728

Abstract: A substrate liquid processing apparatus of the present disclosure supplies a plurality of processing liquids from a processing liquid supplying unit in a switching manner to a substrate held on a substrate holding unit. An elevatable inner cup surrounds the substrate holding unit laterally and forms a first drain path that drains the first processing liquid. An outer cup surrounds the inner cup and forms a second drain path that drains the second processing liquid. A cover covers the outside of the outer cup, includes an eaves portion that extends inwardly from an upper side, and forms an exhaust path between the cover and the outer cup. The exhaust path is connected to the first drain path and the second drain path above inlets of the first drain path and the second drain path.

公开(公告)号：US20170200624A1

公开(公告)日：2017-07-13

申请号：US15390902

申请日：2016-12-27

Applicant: Tokyo Electron Limited

Inventor： Jiro Higashijima ,  Nobuhiro Ogata ,  Yusuke Hashimoto

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/10 ,  B08B11/00 ,  B08B3/04 ,  B08B3/08

CPC classification number: H01L21/67051 ,  B08B3/10 ,  B08B17/025 ,  B08B2203/0229 ,  C11D11/0047 ,  H01L21/02041

Abstract: Disclosed is a substrate processing apparatus including: a holding unit configured to hold a substrate; a processing liquid supply unit configured to supply a first processing liquid and a second processing liquid to the substrate; a first cup configured to recover the first processing liquid; a second cup disposed adjacent to the first cup and configured to recover the second processing liquid; a recovery portion defined by a peripheral wall portion that is erected on a bottom portion of the first cup; and a cleaning liquid supply unit configured to supply a cleaning liquid to the recovery portion. The peripheral wall portion is cleaned by causing the cleaning liquid supplied by the cleaning liquid supply unit to overflow from the peripheral wall portion to the second cup side.