公开(公告)号：US10297473B2

公开(公告)日：2019-05-21

申请号：US15681672

申请日：2017-08-21

Applicant: Tokyo Electron Limited

Inventor： Terufumi Wakiyama ,  Norihiro Ito ,  Jiro Higashijima

IPC: H01L21/67 ,  B08B17/00

Abstract: A liquid processing apparatus performs a liquid processing on a rotating substrate by supplying a processing liquid. Surrounding members surround a region including an upper space of a cup body surrounding the rotating substrate and provided with an opening above the substrate. An air flow forming portion forms a descending air flow from an upper side of the cup body. A bottom surface portion blocks between the cup body and the surrounding member along a circumferential direction. An exhaust port is provided above the bottom surface portion and outside the cup body to exhaust an atmosphere in a region surrounded by the surrounding members and the bottom surface portion.

公开(公告)号：US20170345689A1

公开(公告)日：2017-11-30

申请号：US15681672

申请日：2017-08-21

Applicant: Tokyo Electron Limited

Inventor： Terufumi Wakiyama ,  Norihiro Ito ,  Jiro Higashijima

IPC: H01L21/67 ,  B08B17/00

CPC classification number: H01L21/67051 ,  B08B17/00 ,  H01L21/67017 ,  H01L21/6719

Abstract: A liquid processing apparatus performs a liquid processing on a rotating substrate by supplying a processing liquid. Surrounding members surround a region including an upper space of a cup body surrounding the rotating substrate and provided with an opening above the substrate. An air flow forming portion forms a descending air flow from an upper side of the cup body. A bottom surface portion blocks between the cup body and the surrounding member along a circumferential direction. An exhaust port is provided above the bottom surface portion and outside the cup body to exhaust an atmosphere in a region surrounded by the surrounding members and the bottom surface portion.

公开(公告)号：US09773687B2

公开(公告)日：2017-09-26

申请号：US14483252

申请日：2014-09-11

Applicant: Tokyo Electron Limited

Inventor： Terufumi Wakiyama ,  Norihiro Ito ,  Jiro Higashijima

IPC: B08B3/02 ,  H01L21/67 ,  B08B17/00

CPC classification number: H01L21/67051 ,  B08B17/00 ,  H01L21/67017 ,  H01L21/6719

Abstract: A liquid processing apparatus performs a liquid processing on a rotating substrate by supplying a processing liquid. Surrounding members surround a region including an upper space of a cup body surrounding the rotating substrate and provided with an opening above the substrate. An air flow forming portion forms a descending air flow from an upper side of the cup body. A bottom surface portion blocks between the cup body and the surrounding member along a circumferential direction. An exhaust port is provided above the bottom surface portion and outside the cup body to exhaust an atmosphere in a region surrounded by the surrounding members and the bottom surface portion.

公开(公告)号：US09378940B2

公开(公告)日：2016-06-28

申请号：US13916826

申请日：2013-06-13

Applicant: Tokyo Electron Limited

Inventor： Hisashi Kawano ,  Norihiro Ito ,  Yosuke Hachiya ,  Jun Nogami ,  Kotaro Ooishi ,  Itaru Kanno

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/311

CPC classification number: H01L21/02057 ,  G03F7/423 ,  H01L21/31133 ,  H01L21/67051

Abstract: The present disclosure provides a substrate processing apparatus including: a substrate processing chamber configured to process a substrate on which a target layer to be removed is formed on the surface of an underlying layer; a substrate holding unit provided in the substrate processing chamber and configured to hold the substrate; a mixed liquid supplying unit configured to supply a mixed liquid of sulfuric acid and hydrogen peroxide to the substrate held by the substrate holding unit in a mixing ratio of the hydrogen peroxide and a temperature that does not damage the underlying layer while removing the target layer; and an OH-group supplying unit configured to supply a fluid containing OH-group to the substrate in an amount that does not damage the underlying layer when the mixed liquid and the OH-group are mixed on the substrate.

Abstract translation: 本公开提供了一种基板处理装置，包括：基板处理室，被配置为处理其上形成有待去除的目标层的基板，其在下层的表面上形成; 衬底保持单元，设置在所述衬底处理室中并且构造成保持所述衬底; 混合液体供给单元，其被配置为在由所述基板保持单元保持的所述基板以与所述过氧化氢的混合比例和不除去所述下层的温度同时移除所述目标层的同时，供给硫酸和过氧化氢的混合液; 以及OH基供给单元，其构成为，在混合液和OH基混合在基板上时，向基板供给含有OH基团的流体，其量不会损伤下层。

公开(公告)号：US20140248774A1

公开(公告)日：2014-09-04

申请号：US14234493

申请日：2012-10-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kazuhiro Aiura ,  Norihiro Ito

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/306

CPC classification number: H01L21/02076 ,  H01L21/30604 ,  H01L21/67051 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/6719

Abstract: The liquid treatment apparatus according to the present invention includes a substrate holder configured to horizontally hold a substrate, and a top plate configured to be rotatable and to cover the substrate held by the substrate holder from above so as to define a treatment space. In the treatment space, a chemical liquid is supplied by a chemical liquid nozzle onto the substrate, and an atmosphere replacement gas is supplied by a replacement nozzle into the treatment space. The replacement nozzle is supported by a replacement nozzle support arm configured to be horizontally moved between an advanced position at which the replacement nozzle support arm is advanced into the treatment space and a retracted position at which the replacement nozzle support arm is retracted outside from the treatment space. The replacement nozzle is configured to discharge, above the substrate, the atmosphere replacement gas upward.

Abstract translation: 根据本发明的液体处理装置包括：基板保持器，其被构造成水平地保持基板;以及顶板，其构造成可旋转并且从上方覆盖由基板保持器保持的基板，以限定处理空间。 在处理空间中，化学液体喷嘴将化学液体供给到基板上，通过置换喷嘴将气体置换气体供给到处理空间。 替换喷嘴由替换喷嘴支撑臂支撑，所述替换喷嘴支撑臂构造成在更换喷嘴支撑臂前进到处理空间的前进位置和替换喷嘴支撑臂从处理之外缩回的缩回位置之间水平移动 空间。 更换喷嘴被配置为在基板上方向上排放大气置换气体。

公开(公告)号：US20140137902A1

公开(公告)日：2014-05-22

申请号：US14084839

申请日：2013-11-20

Applicant: Tokyo Electron Limited

Inventor： Kazuhiro Aiura ,  Norihiro Ito ,  Hidetoshi Nakao ,  Kazuyoshi Shinohara ,  Satoru Tanaka ,  Yuki Yoshida ,  Meitoku Aibara

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/68735

Abstract: A substrate processing apparatus includes a rotary cup that is provided at a substrate holding unit to surround a substrate held thereon and to be rotated along with the substrate holding unit, and configured to guide a processing liquid dispersed from the substrate; and an outer cup that is provided around the rotary cup with a gap therebetween and configured to collect the guided processing liquid by the rotary cup. Further, a height of an upper end of the rotary cup is higher than that of the outer cup. Furthermore, an outward protrusion protruded outwards in a radial direction thereof and extended along a circumference thereof is provided at an upper end portion of an outer surface of the rotary cup, and the outward protrusion blocks mist of the processing liquid dispersed from the gap between the rotary cup and the outer cup toward a space above the substrate.

Abstract translation: 一种基板处理装置，包括旋转杯，该旋转杯设置在基板保持单元处，以围绕保持在其上的基板并与基板保持单元一起旋转，并且构造成引导从基板分散的处理液; 以及外杯，其设置在旋转杯周围，其间具有间隙，并且构造成通过旋转杯收集被引导的处理液。 此外，旋转杯的上端的高度高于外杯的高度。 此外，在旋转杯的外表面的上端部设置有沿其径向向外突出并且沿着其周向延伸的向外突出部，并且向外突出部阻挡从位于旋转杯之间的间隙分散的处理液的雾 旋转杯和外杯朝向衬底上方的空间。

公开(公告)号：US10580669B2

公开(公告)日：2020-03-03

申请号：US15657356

申请日：2017-07-24

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Fukushima ,  Kazuhiro Aiura ,  Norihiro Ito

IPC: H01L21/67

Abstract: After a discharge of a processing liquid is stopped, a position of a liquid surface within a nozzle can be observed. A substrate processing apparatus includes a substrate holding mechanism and the nozzle. The substrate holding mechanism is configured to hold a substrate. The nozzle is configured to supply the processing liquid to the substrate. The nozzle includes a pipe member and an observation window. The pipe member has a horizontal part and a downward part extended downwards from the horizontal part, and is configured to discharge the processing liquid from a tip end of the downward part. The observation window is provided at the horizontal part of the pipe member.

公开(公告)号：US10276425B2

公开(公告)日：2019-04-30

申请号：US14943138

申请日：2015-11-17

Applicant: Tokyo Electron Limited

Inventor： Terufumi Wakiyama ,  Norihiro Ito ,  Jiro Higashijima ,  Satoshi Biwa

IPC: H01L21/67 ,  H01L21/687

Abstract: A substrate processing system includes: a holding plate provided to be rotatable around a vertical axis; a substrate holding member provided on the holding plate to hold a substrate; a rotary drive unit that rotates the substrate in a predetermined direction; and a processing fluid supply unit that supplies a processing liquid to the substrate. The substrate holding member includes a first side portion provided at a position facing the substrate and a second side portion and a third side portion that are adjacent to the first side portion. The first side portion includes a gripping portion configured to grip an end surface of the substrate. The second side portion forms a pointed end portion with the first side portion, and includes a liquid flow guide portion that guides the processing liquid to a lower side of the substrate after the processing liquid is supplied to the substrate.

公开(公告)号：US20180226277A1

公开(公告)日：2018-08-09

申请号：US15881984

申请日：2018-01-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Terufumi Wakiyama ,  Norihiro Ito

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6708 ,  H01L21/67051 ,  H01L21/68792

Abstract: A liquid processing apparatus according to an embodiment includes a holding unit, a driving unit, a shaft, and a nozzle. The driving unit rotates the substrate and the holding unit that horizontally holds the substrate. The shaft is extended along an axial direction of a rotation axis. The nozzle includes a base that is attached to an upper end of the shaft, and a liquid supply unit that is extended from the base to a radial-direction outer side of the substrate and includes discharge ports formed to discharge the liquid toward a lower surface of the substrate. The shaft and the base are configured to include a discharge passage that is formed along the axial direction to discharge the liquid discharged toward the lower surface of the substrate. The base includes a concave portion that is concave downward to cause the liquid to flow toward the discharge passage.

公开(公告)号：US09953848B2

公开(公告)日：2018-04-24

申请号：US14580557

申请日：2014-12-23

Applicant: Tokyo Electron Limited

Inventor： Terufumi Wakiyama ,  Norihiro Ito ,  Jiro Higashijima

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/6715 ,  H01L21/68728

Abstract: A substrate liquid processing apparatus of the present disclosure supplies a plurality of processing liquids from a processing liquid supplying unit in a switching manner to a substrate held on a substrate holding unit. An elevatable inner cup surrounds the substrate holding unit laterally and forms a first drain path that drains the first processing liquid. An outer cup surrounds the inner cup and forms a second drain path that drains the second processing liquid. A cover covers the outside of the outer cup, includes an eaves portion that extends inwardly from an upper side, and forms an exhaust path between the cover and the outer cup. The exhaust path is connected to the first drain path and the second drain path above inlets of the first drain path and the second drain path.