- 专利标题: Three capacitor stack and associated methods
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申请号: US15282504申请日: 2016-09-30
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公开(公告)号: US09960224B2公开(公告)日: 2018-05-01
- 发明人: Eng Huat Goh , Jiun Hann Sir , Han Kung Chua , Min Suet Lim , Hoay Tien Teoh
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwegman Lundberg & Woessner, P.A.
- 主分类号: H01L49/02
- IPC分类号: H01L49/02
摘要:
A three capacitor stack and associated methods are shown. An exemplary capacitor device may include a first capacitor stack that includes a first plurality of layers of reference electrodes interleaved with first capacitor electrodes, a second capacitor stack on the first capacitor stack that includes a second plurality of layers of reference electrodes interleaved with second capacitor electrodes, and a third capacitor stack on the second capacitor stack that includes a reference electrode and a third capacitor electrode. A respective layer of dielectric material is formed between the reference electrodes and the first capacitor electrodes, the second capacitor electrodes, and the third capacitor electrode.
公开/授权文献
- US20180097056A1 THREE CAPACITOR STACK AND ASSOCIATED METHODS 公开/授权日:2018-04-05
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