Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US15141946Application Date: 2016-04-29
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Publication No.: US09964358B2Publication Date: 2018-05-08
- Inventor: Jun Matsushita , Takashi Miyamoto , Konosuke Hayashi , Osamu Yamazaki
- Applicant: SHIBAURA MECHATRONICS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Volpe and Koenig, P.C.
- Priority: JP2015-093549 20150430; JP2016-059818 20160324
- Main IPC: F26B3/30
- IPC: F26B3/30 ; H01L21/67

Abstract:
The substrate processing unit 1 comprises the rotating table 31 configured to hold substrate W, the processing chamber 37 which accommodates the rotating table 31, a lamp 61 is provided above the processing chamber 37 and configured to heat the surface of substrate W, the lamp chamber 60 which accommodates that lamp 61, a transmission window 62 disposed below the lamp chamber 60, and a plurality of nozzle 64 which supply cooling fluid G to the transmission window 62. Then the substrate processing unit 1 can suppress generating of a water mark or pattern collapse, and can perform good substrate processing.
Public/Granted literature
- US20160322241A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2016-11-03
Information query
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