Invention Grant
- Patent Title: Arrangement and method for manufacturing the same
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Application No.: US15361108Application Date: 2016-11-25
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Publication No.: US09966277B2Publication Date: 2018-05-08
- Inventor: Markus Zundel , Andre Schmenn , Damian Sojka , Isabella Goetz , Gudrun Stranzl , Sebastian Werner , Thomas Fischer , Carsten Ahrens , Edward Fuergut
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner mbB
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/56 ; H01L23/498 ; H01L27/02 ; H01L23/31 ; H01L29/861

Abstract:
An arrangement is provided. The arrangement may include: a substrate having a front side and a back side, a die region within the substrate, a multi-purpose layer defining a back side of the die region, and an etch stop layer disposed over the multi-purpose layer between the multi-purpose layer and the back side of the substrate. The multi-purpose layer may be formed of an ohmic material, and the etch stop layer may be of a first conductivity type of a first doping concentration.
Public/Granted literature
- US20170076961A1 ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-03-16
Information query
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