Invention Grant
- Patent Title: Next generation form factor connector
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Application No.: US15329474Application Date: 2014-07-31
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Publication No.: US09966678B2Publication Date: 2018-05-08
- Inventor: Chin-Lung Chiang , Jyun-Jie Wang , Meng-Chen Wu , Raghavan V Venugopal , Patrick Raymond , Andrew Potter
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee Address: US TX Houston
- Agency: Brooks, Cameron & Huebsch, PLLC
- International Application: PCT/US2014/049109 WO 20140731
- International Announcement: WO2016/018356 WO 20160204
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/72 ; H01R12/71 ; H01R13/24
Abstract:
A Next Generation Form Factor (NGFF) connector apparatus can include a plurality of upper signal pins and an upper ground (GND) pin that is longer than other upper pins. The NGFF connector apparatus can also include a plurality of lower signal pins and a lower power (PWR) pin that is longer than other lower pins.
Public/Granted literature
- US20170214162A1 NEXT GENERATION FORM FACTOR CONNECTOR Public/Granted day:2017-07-27
Information query
