公开(公告)号：US09966678B2

公开(公告)日：2018-05-08

申请号：US15329474

申请日：2014-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Chin-Lung Chiang ,  Jyun-Jie Wang ,  Meng-Chen Wu ,  Raghavan V Venugopal ,  Patrick Raymond ,  Andrew Potter

IPC: H01R12/00 ,  H01R12/72 ,  H01R12/71 ,  H01R13/24

CPC classification number: H01R12/721 ,  H01R12/716 ,  H01R13/2457

Abstract: A Next Generation Form Factor (NGFF) connector apparatus can include a plurality of upper signal pins and an upper ground (GND) pin that is longer than other upper pins. The NGFF connector apparatus can also include a plurality of lower signal pins and a lower power (PWR) pin that is longer than other lower pins.

公开(公告)号：US10684664B2

公开(公告)日：2020-06-16

申请号：US15314785

申请日：2014-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Raghavan V. Venugopal ,  Patrick A. Raymond ,  William C. Hallowell ,  Han Wang ,  Chin-Lung Chiang ,  Jyun-Jie Wang

IPC: G06F1/26 ,  G06F11/14 ,  G06F11/20 ,  G06F11/30 ,  G06F1/30 ,  G06F3/06

Abstract: A test and diagnostics circuit, methods and systems are described. An example test and diagnostics circuit includes a controller and a power monitor coupled to the controller. A load switch on the test and diagnostics circuit selectably implements a load from among multiple load values to test a computing and/or data storage system. The test and diagnostics circuit includes circuitry connecting the controller, the power monitor and the load switch to receive a test enable signal from a non-dedicated pin in a non-volatile dual inline memory module (NV-DIMM) slot to implement a test operation on the system.

公开(公告)号：US10193251B2

公开(公告)日：2019-01-29

申请号：US15327727

申请日：2014-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Chin-Lung Chiang ,  Jyun-Jie Wang ,  Andrew Potter ,  Raghavan V Venugopal

IPC: H01R13/50 ,  H01R13/62 ,  H01R12/71 ,  H05K7/14 ,  G06F1/18 ,  H01R12/70

Abstract: A Next Generation Form Factor (NGFF) carrier includes a flat component perpendicularly connected to two flat side components to receive an NGFF module, a bar rotatably connected to the two flat side components, and a number of holds along an interior of the flat component to receive a fastener. The NGFF module is insertable in relation to the flat component when the bar is rotated to a first position and fixed on the flat component when the bar is rotated to a second position.

公开(公告)号：US20160286678A1

公开(公告)日：2016-09-29

申请号：US15033626

申请日：2014-01-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Raghavan V Venugopal ,  Chin-Lung Chiang ,  Patrick A Raymond ,  Chih-Chiang Chen

IPC: H05K7/14 ,  G06F13/40

CPC classification number: H05K7/1439 ,  G06F1/185 ,  G06F13/4068 ,  G06F13/409

Abstract: Devices and methods for engagement of an expansion card (312) with an expansion slot (104) of a printed circuit board (PCB) based connector (102) are described. In one example, an expansion card module (300) includes a card housing (302) to house an expansion card (312). The card housing (302) includes a groove (304) for engaging the card housing (302) with a locking element (202) of a device case housing (200) to mount the expansion card module (300) in the device case housing (200). The expansion card module (300) also includes a module mounted actuator (306) pivotally mounted on the card housing (302) to engage with the locking element (202) for actuating the expansion card module (300) to engage the expansion card (312) with at least one expansion slot (104) of the PCB based connector (102).

Abstract translation: 描述了用于将扩展卡（312）与基于印刷电路板（PCB）的连接器（102）的扩展槽（104）接合的装置和方法。 在一个示例中，扩展卡模块（300）包括容纳扩展卡（312）的卡壳（302）。 卡壳体（302）包括用于将卡壳体（302）与装置壳体壳体（200）的锁定元件（202）接合以将扩展卡模块（300）安装在装置壳体壳体（200）中的凹槽（304） 200）。 扩展卡模块（300）还包括可枢转地安装在卡壳体（302）上的模块安装致动器（306），以与锁定元件（202）啮合，用于致动扩展卡模块（300）以接合扩展卡 ）与PCB基连接器（102）的至少一个扩展槽（104）连接。