Invention Grant
- Patent Title: Compressive strain semiconductor substrates
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Application No.: US15453118Application Date: 2017-03-08
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Publication No.: US09972684B2Publication Date: 2018-05-15
- Inventor: Karthik Balakrishnan , Pouya Hashemi , Nicolas J. Loubet , Alexander Reznicek
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Louis J. Percello
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L21/02 ; H01L29/16 ; H01L29/06

Abstract:
A method for forming a compressively strained semiconductor substrate includes forming a lattice adjustment layer on a semiconductor substrate by forming compound clusters within an epitaxially grown semiconductor matrix. The lattice adjustment layer includes a different lattice constant than the semiconductor substrate. A rare earth oxide is grown and lattice matched to the lattice adjustment layer. A semiconductor layer is grown and lattice matched to the rare earth oxide and includes a same material as the semiconductor substrate such that the semiconductor layer is compressively strained.
Public/Granted literature
- US20180108736A1 COMPRESSIVE STRAIN SEMICONDUCTOR SUBSTRATES Public/Granted day:2018-04-19
Information query
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