Invention Grant
- Patent Title: Light emitting diode for surface mount technology, method of manufacturing the same, and method of manufacturing light emitting diode module
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Application No.: US15685888Application Date: 2017-08-24
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Publication No.: US09997673B2Publication Date: 2018-06-12
- Inventor: Jong Hyeon Chae , Jong Min Jang , Won Young Roh , Dae Woong Suh , Min Woo Kang , Joon Sub Lee , Hyun A Kim
- Applicant: Seoul Viosys Co., Ltd.
- Applicant Address: KR Ansan-si
- Assignee: Seoul Viosys Co., Ltd.
- Current Assignee: Seoul Viosys Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2012-0070129 20120628
- Main IPC: H01L33/40
- IPC: H01L33/40 ; H01L33/38 ; H01L33/32 ; H01L33/00 ; H01L33/06 ; H01L33/12 ; H01L33/62 ; H01L33/60 ; H01L33/48 ; H01L33/46 ; H01L33/44 ; H01L33/20

Abstract:
A light emitting diode (LED) includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, a first conductive layer disposed on a portion of the second semiconductor layer, a second conductive layer disposed on the second semiconductor layer, and an insulation layer including a first insulating layer and a second insulating layer disposed on the first insulating layer, and overlapping the first semiconductor layer, the second semiconductor layer, and the second conductive layer, in which the insulation layer has a first region having different thicknesses and a second region having a substantially constant thickness.
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