Invention Application
- Patent Title: MODULAR ARCHITECTURE FOR HIGH BANDWIDTH COMPUTERS
- Patent Title (中): 高带宽计算机的模块化架构
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Application No.: PCT/US9502676Application Date: 1995-03-09
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Publication No.: WO9524729A3Publication Date: 1996-05-02
- Inventor: CRANE STANFORD W JR , PORTUONDO MARIA M , ERICKSON WILLARD , BIZZARRI MAURICE
- Applicant: PANDA PROJECT
- Assignee: PANDA PROJECT
- Current Assignee: PANDA PROJECT
- Priority: US20887794 1994-03-11
- Main IPC: G06F1/18
- IPC: G06F1/18 ; G06F13/00 ; G06F13/14 ; G06F13/40 ; G06F15/00 ; G06F15/76 ; G06F15/78 ; H01R12/50 ; H01R33/00 ; H05K1/00 ; H05K1/14 ; H05K7/10 ; H05K7/14 ; H05K7/18 ; H01L
Abstract:
A computeur system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly, a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.
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