Invention Application
WO2006062766A2 EFFICIENT MICRO-MACHINING APPARATUS AND METHOD EMPLOYING MULTIPLE LASER BEAMS
审中-公开
使用多激光束的有效微加工设备和方法
- Patent Title: EFFICIENT MICRO-MACHINING APPARATUS AND METHOD EMPLOYING MULTIPLE LASER BEAMS
- Patent Title (中): 使用多激光束的有效微加工设备和方法
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Application No.: PCT/US2005/043112Application Date: 2005-11-29
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Publication No.: WO2006062766A2Publication Date: 2006-06-15
- Inventor: CUTLER, Donald, R. , BAIRD, Brian, W. , HARRIS, Richard, S. , HEMENWAY, David, M. , LO, Ho Wai , NILSEN, Brady, E. , OSAKO, Yasu , SUN, Lei , SUN, Yunlong , UNRATH, Mark, A.
- Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC. , CUTLER, Donald, R. , BAIRD, Brian, W. , HARRIS, Richard, S. , HEMENWAY, David, M. , LO, Ho Wai , NILSEN, Brady, E. , OSAKO, Yasu , SUN, Lei , SUN, Yunlong , UNRATH, Mark, A.
- Applicant Address: 13900 Nw Science Park Drive, Portland, Oregon 97229-5497 US
- Assignee: ELECTRO SCIENTIFIC INDUSTRIES, INC.,CUTLER, Donald, R.,BAIRD, Brian, W.,HARRIS, Richard, S.,HEMENWAY, David, M.,LO, Ho Wai,NILSEN, Brady, E.,OSAKO, Yasu,SUN, Lei,SUN, Yunlong,UNRATH, Mark, A.
- Current Assignee: ELECTRO SCIENTIFIC INDUSTRIES, INC.,CUTLER, Donald, R.,BAIRD, Brian, W.,HARRIS, Richard, S.,HEMENWAY, David, M.,LO, Ho Wai,NILSEN, Brady, E.,OSAKO, Yasu,SUN, Lei,SUN, Yunlong,UNRATH, Mark, A.
- Current Assignee Address: 13900 Nw Science Park Drive, Portland, Oregon 97229-5497 US
- Agency: ANGELLO, Paul, S.
- Priority: US11/000,330 20041129; US11/000,333 20041129
- Main IPC: H01S3/10
- IPC: H01S3/10 ; H01S3/08
Abstract:
A laser beam switching system (50) employs a laser (52) coupled to a beam switching device (58) that causes a laser beam to switch between first and second beam positioning heads such that while the first beam positioning head (60) is directing the laser beam to process a workpiece target location, the second beam positioning head (62) is moving to another target location and vice versa. A preferred beam switching device includes first and second AOMs. When RF is applied to the first AOM (72), the laser beam is diffracted toward the first beam positioning head, and when RF is applied to the second AOM (74), the laser beam is diffracted toward the second beam positioning head. A workpiece processing system (120) employs a common modular imaged optics assembly (122) and an optional variable beam expander (94) for optically processing multiple laser beams.
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