公开(公告)号：WO2007011604A1

公开(公告)日：2007-01-25

申请号：PCT/US2006/027032

申请日：2006-07-11

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC. ,  HEMENWAY, David Martin ,  NILSEN, Brady ,  LO, Ho Wai ,  GRANT, Keith

Inventor： HEMENWAY, David Martin ,  NILSEN, Brady ,  LO, Ho Wai ,  GRANT, Keith

IPC: H01L21/027

CPC classification number: B23K26/0665 ,  B23K26/032 ,  B23K26/064 ,  B23K26/0648 ,  B23K2201/40

Abstract: A method of suppressing distortion of a working laser beam (12') directed for incidence on a target specimen (14) presented for processing by a laser link processing system (100) uses a spatial filter (102) to remove stray light-induced distortion from the working laser beam.

Abstract translation: 一种抑制用于入射到由激光连接处理系统（100）处理的目标样本（14）上的工作激光束（12'）的变形的方法使用空间滤波器（102）去除杂散光诱导失真 从工作激光束。

公开(公告)号：WO2006125217A3

公开(公告)日：2006-11-23

申请号：PCT/US2006/019780

申请日：2006-05-18

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC. ,  UNRATH, Mark A. ,  JOHANSEN, Brian ,  LO, Ho Wai

Inventor： UNRATH, Mark A. ,  JOHANSEN, Brian ,  LO, Ho Wai

IPC: B23K26/00

Abstract: A method and system for increasing throughput of laser micromachining systems use more than one laser. Two or more pulsed laser beams (56, 58) are combined and then separated into multiple laser beams (80, 82) that enable the system to work simultaneously at multiple locations on the workpiece (20) with pulse rates greater than those achievable with independently operating lasers while maintaining pulse energy equal to or greater than the pulse energy of each of the original independent laser beams. Most laser micromachining applications required multiple sequential pulses to process a workpiece. Increasing the pulse rate while maintaining pulse energy effects more rapid material removal and thereby increases throughput for a laser micromachining system.

公开(公告)号：WO2005016586A3

公开(公告)日：2006-02-23

申请号：PCT/US2004026977

申请日：2004-08-18

Applicant: ELECTRO SCIENT IND INC ,  SUN YUNLONG ,  HARRIS RICHARD S ,  LO HO WAI ,  BAIRD BRIAN W ,  JOHNSON JAY CHRISTOPHER

Inventor： SUN YUNLONG ,  HARRIS RICHARD S ,  LO HO WAI ,  BAIRD BRIAN W ,  JOHNSON JAY CHRISTOPHER

IPC: B23K20060101 ,  B23K26/06 ,  B23K26/38 ,  H01S20060101 ,  H04J14/02 ,  B23K26/00

CPC classification number: H01L23/5258 ,  B23K26/0613 ,  B23K26/0622 ,  B23K2201/40 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.

Abstract translation: 具有特别定制的时间功率特性的激光脉冲，而不是传统的时间形状或基本上正方形的形状，切断了IC连接。 特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰​​。 尖峰的定时优先设置在链路被大部分去除的时间之前。 特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层 链接。

公开(公告)号：WO2006009818A2

公开(公告)日：2006-01-26

申请号：PCT/US2005/021406

申请日：2005-06-16

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC. ,  BRULAND, Kelly J. ,  LO, Ho Wai ,  BAIRD, Brian W. ,  EVANS, Frank G. ,  HARRIS, Richard S. ,  SUN, Yunlong ,  SWARINGEN, Stephen N.

Inventor： BRULAND, Kelly J. ,  LO, Ho Wai ,  BAIRD, Brian W. ,  EVANS, Frank G. ,  HARRIS, Richard S. ,  SUN, Yunlong ,  SWARINGEN, Stephen N.

IPC: H01L21/00 ,  H01L21/302 ,  H01L21/26 ,  H01L21/84 ,  H01L21/461 ,  H01L21/324 ,  H01L21/42 ,  H01L21/477

CPC classification number: B23K26/067 ,  B23K26/0676 ,  B23K26/0853 ,  B23K2201/40 ,  G11C17/143 ,  G11C17/16 ,  G11C17/18 ,  G11C29/02 ,  G11C29/027 ,  H01L21/268 ,  H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods and systems process electrically conductive links on or within a semiconductor substrate (740) using multiple laser beams. For example, a method utilizes N series of laser pulses to obtain a throughput benefit, wherein N ≥ 2. The links are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The N series of laser pulses propagate along N respective beam axes until incident upon selected links. The pattern of resulting laser spots may be on links in N distinct rows, on distinct links in the same row, or on the same link, either partially or completely overlapping. The resulting laser spots may be offset from one another in the lengthwise direction of the rows or offset from one another in a direction perpendicular to the lengthwise direction of the rows, or both.

Abstract translation: 方法和系统使用多个激光束在半导体衬底（740）上或内部处理导电链路。 例如，一种利用N系列激光脉冲获得吞吐量优点的方法，其中N = 2。所述链路被布置成沿大致长度方向延伸的多个基本平行的行。 N系列激光脉冲沿着N个相应的波束轴传播，直到在所选择的链路上入射。 所产生的激光斑点的图案可以是N个不同行中的链接，在相同行中的不同链接上，或者在同一链接上，部分地或完全重叠。 所得到的激光点可以在行的长度方向上彼此偏移，或者在与行的长度方向垂直的方向上彼此偏移，或者两者偏离。

公开(公告)号：WO2006062766A2

公开(公告)日：2006-06-15

申请号：PCT/US2005/043112

申请日：2005-11-29

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC. ,  CUTLER, Donald, R. ,  BAIRD, Brian, W. ,  HARRIS, Richard, S. ,  HEMENWAY, David, M. ,  LO, Ho Wai ,  NILSEN, Brady, E. ,  OSAKO, Yasu ,  SUN, Lei ,  SUN, Yunlong ,  UNRATH, Mark, A.

Inventor： CUTLER, Donald, R. ,  BAIRD, Brian, W. ,  HARRIS, Richard, S. ,  HEMENWAY, David, M. ,  LO, Ho Wai ,  NILSEN, Brady, E. ,  OSAKO, Yasu ,  SUN, Lei ,  SUN, Yunlong ,  UNRATH, Mark, A.

IPC: H01S3/10 ,  H01S3/08

CPC classification number: B23K26/0673 ,  B23K26/0622 ,  B23K26/067 ,  B23K26/082

Abstract: A laser beam switching system (50) employs a laser (52) coupled to a beam switching device (58) that causes a laser beam to switch between first and second beam positioning heads such that while the first beam positioning head (60) is directing the laser beam to process a workpiece target location, the second beam positioning head (62) is moving to another target location and vice versa. A preferred beam switching device includes first and second AOMs. When RF is applied to the first AOM (72), the laser beam is diffracted toward the first beam positioning head, and when RF is applied to the second AOM (74), the laser beam is diffracted toward the second beam positioning head. A workpiece processing system (120) employs a common modular imaged optics assembly (122) and an optional variable beam expander (94) for optically processing multiple laser beams.

Abstract translation: 激光束切换系统（50）采用耦合到光束切换装置（58）的激光器（52），该激光器使激光束在第一和第二光束定位头之间切换，使得当第一 射束定位头（60）引导激光束来处理工件目标位置，第二射束定位头（62）移动到另一个目标位置，反之亦然。 优选的射束切换装置包括第一和第二AOM。 当RF施加到第一AOM（72）时，激光束被朝向第一光束定位头衍射，并且当RF被施加到第二AOM（74）时，激光束被衍射向第二光束定位头。 工件处理系统（120）采用共同的模块化成像光学组件（122）和可选的可变光束扩展器（94），用于光学处理多个激光束。

公开(公告)号：WO2008019252A1

公开(公告)日：2008-02-14

申请号：PCT/US2007/074773

申请日：2007-07-30

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC. ,  LO, Ho Wai ,  HEMENWAY, David Martin ,  NILSEN, Brady ,  BRULAND, Kelly J.

Inventor： LO, Ho Wai ,  HEMENWAY, David Martin ,  NILSEN, Brady ,  BRULAND, Kelly J.

IPC: H01L21/66 ,  H01L21/82

CPC classification number: H01L23/5258 ,  G11C17/14 ,  G11C17/143 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system (700A, 700B, 800) determines relative positions of a semiconductor substrate (240) and a plurality of laser beam spots on or within the semiconductor substrate (240) in a machine for selectively irradiating structures on or within the substrate using a plurality of laser beams. The system (700A, 700B, 800) comprises a laser source (220, 720), first and second laser beam propagation paths, first and second reflection sensors (798, 853), and a processor (680). The laser source (220, 720) produces at least the first and second laser beams, which propagate toward the substrate along the first and second propagation paths, respectively, which have respective first and second axes that intersects the substrate at respective first and second spots. The reflection sensors (798, 853) are positioned to detect reflection of the spots, as the spots moves relative to the substrate, thereby generating reflection signals. The processor (680) is configured to determine, based on the reflection signals, positions of the spots on or within the substrate (240).

Abstract translation: 系统（700A，700B，800）确定半导体衬底（240）中的多个激光束斑点和半导体衬底（240）内的多个激光束斑点在机器中的相对位置，用于使用多个 的激光束。 系统（700A，700B，800）包括激光源（220,720），第一和第二激光束传播路径，第一和第二反射传感器（798,853）以及处理器（680）。 所述激光源（220,720）至少产生所述第一和第二激光束，所述第一和第二激光束分别沿着所述第一和第二传播路径传播到所述衬底，所述第一和第二激光束具有相应的第一和第二轴线，所述第一和第二轴线在相应的第一和第二点 。 当反射传感器（798,853）相对于基板移动时，反射传感器（798,853）被定位成检测光斑的反射，从而产生反射信号。 处理器（680）被配置为基于反射信号确定衬底（240）上或衬底（240）内的点的位置。

公开(公告)号：WO2008016832A1

公开(公告)日：2008-02-07

申请号：PCT/US2007/074506

申请日：2007-07-26

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC. ,  HOLMGREN, Douglas, Earl ,  LO, Ho, Wai ,  CONKLIN, Philip, Mitchell

Inventor： HOLMGREN, Douglas, Earl ,  LO, Ho, Wai ,  CONKLIN, Philip, Mitchell

IPC: G02B26/08

CPC classification number: B23K26/067 ,  B23K26/04 ,  B23K26/043 ,  B23K26/0608 ,  B23K2201/40

Abstract: A method of and system for forming two laser processing beams with controlled stability at a target specimen work surface includes first and second mutually coherent laser beams (130, 140) propagating along separate first and second beam paths that are combined (170) to perform an optical property adjustment. The combined laser beams are separated (190) into third and fourth laser beams (192, 194) propagating along separate beam paths and including respective third and fourth main beam components (192l), and one of the third and fourth laser beams contributes a leakage component that copropagates in mutual temporal coherence with the main beam component (192m) of the other of the third and fourth laser beams. An effect of mutual temporal coherence of the leakage component and the other main beam component with which the leakage component copropagates is reduced through acousto-optic modulation (150, 160) frequency shifts or through incorporation of an optical path length difference (404, 504) in the two beams.

Abstract translation: 用于在目标样品工作表面处形成具有受控稳定性的两个激光加工光束的方法和系统包括沿着分离的第一和第二光束路径传播的第一和第二相互相干的激光束（130,140），所述第一和第二光束路径被组合（170） 光学性能调整。 组合的激光束被分离（190）到沿着分离的光束路径传播并且包括相应的第三和第四主光束分量（192l）的第三和第四激光束（192,194），并且第三和第四激光束中的一个激励有助于泄漏 与第三和第四激光束中的另一个的主光束分量（192m）相互时间相干地共同传播的部件。 通过声光调制（150,160）频移或通过并入光程长度差（404,504）来减少泄漏分量和泄漏分量共同传播的其它主波束分量的相互时间相干性的影响， 在两个梁。

公开(公告)号：WO2006063153A3

公开(公告)日：2007-06-07

申请号：PCT/US2005044449

申请日：2005-12-07

Applicant: ELECTRO SCIENT IND INC ,  SUN YUNLONG ,  BRULAND KELLY ,  HAINSEY ROBERT F ,  HARRIS RICHARD ,  JORDENS WILLIAM J ,  LO HO WAI ,  SUN LEI

Inventor： SUN YUNLONG ,  BRULAND KELLY ,  HAINSEY ROBERT F ,  HARRIS RICHARD ,  JORDENS WILLIAM J ,  LO HO WAI ,  SUN LEI

IPC: B23K26/40 ,  H01L21/461

CPC classification number: B23K26/067 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K2201/40 ,  H01S3/10046 ,  H01S3/117 ,  H01S3/2383

Abstract: A specially shaped laser pulse energy profile (98, 104, 156) characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possible spot size.

Abstract translation: 特征在于在轮廓不同时刻具有不同激光波长的特殊形状的激光脉冲能量分布（98,104,156）提供了减少的受控抖动以实现实现高质量处理的半导体器件微机械加工和较小可能的光斑尺寸。

公开(公告)号：WO2006009818A3

公开(公告)日：2007-03-01

申请号：PCT/US2005021406

申请日：2005-06-16

Applicant: ELECTRO SCIENT IND INC ,  BRULAND KELLY J ,  LO HO WAI ,  BAIRD BRIAN W ,  EVANS FRANK G ,  HARRIS RICHARD S ,  SUN YUNLONG ,  SWARINGEN STEPHEN N

Inventor： BRULAND KELLY J ,  LO HO WAI ,  BAIRD BRIAN W ,  EVANS FRANK G ,  HARRIS RICHARD S ,  SUN YUNLONG ,  SWARINGEN STEPHEN N

IPC: H01L21/26

CPC classification number: B23K26/067 ,  B23K26/0676 ,  B23K26/0853 ,  B23K2201/40 ,  G11C17/143 ,  G11C17/16 ,  G11C17/18 ,  G11C29/02 ,  G11C29/027 ,  H01L21/268 ,  H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods and systems process electrically conductive links on or within a semiconductor substrate (740) using multiple laser beams. For example, a method utilizes N series of laser pulses to obtain a throughput benefit, wherein N = 2. The links are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The N series of laser pulses propagate along N respective beam axes until incident upon selected links. The pattern of resulting laser spots may be on links in N distinct rows, on distinct links in the same row, or on the same link, either partially or completely overlapping. The resulting laser spots may be offset from one another in the lengthwise direction of the rows or offset from one another in a direction perpendicular to the lengthwise direction of the rows, or both.

Abstract translation: 方法和系统使用多个激光束在半导体衬底（740）上或内部处理导电链路。 例如，一种利用N系列激光脉冲获得吞吐量优点的方法，其中N = 2。所述链路被布置成沿大致长度方向延伸的多个基本平行的行。 N系列激光脉冲沿着N个相应的波束轴传播，直到在所选择的链路上入射。 所产生的激光斑点的图案可以是N个不同行中的链接，在相同行中的不同链接上，或者在同一链接上，部分地或完全重叠。 所得到的激光点可以在行的长度方向上彼此偏移，或者在与行的长度方向垂直的方向上彼此偏移，或者两者偏离。

公开(公告)号：WO2006125217A2

公开(公告)日：2006-11-23

申请号：PCT/US2006019780

申请日：2006-05-18

Applicant: ELECTRO SCIENT IND INC ,  UNRATH MARK A ,  JOHANSEN BRIAN ,  LO HO WAI

Inventor： UNRATH MARK A ,  JOHANSEN BRIAN ,  LO HO WAI

CPC classification number: B23K26/0673 ,  B23K26/0006 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/067 ,  B23K2203/16 ,  B23K2203/30 ,  B23K2203/42

Abstract: A method and system for increasing throughput of laser micromachining systems use more than one laser. Two or more pulsed laser beams (56, 58) are combined and then separated into multiple laser beams (80, 82) that enable the system to work simultaneously at multiple locations on the workpiece (20) with pulse rates greater than those achievable with independently operating lasers while maintaining pulse energy equal to or greater than the pulse energy of each of the original independent laser beams. Most laser micromachining applications required multiple sequential pulses to process a workpiece. Increasing the pulse rate while maintaining pulse energy effects more rapid material removal and thereby increases throughput for a laser micromachining system.

Abstract translation: 用于增加激光微加工系统的产量的方法和系统使用多于一个的激光器。 将两个或更多个脉冲激光束（56,58）组合，然后分离成多个激光束（80,82），使得系统能够以大于独立可实现的脉冲速率在工件（20）上的多个位置处同时工作 同时保持脉冲能量等于或大于每个原始独立激光束的脉冲能量的操作激光器。 大多数激光微加工应用需要多个顺序脉冲来处理工件。 在保持脉冲能量的同时提高脉搏率可以更快速地去除材料，从而提高激光微加工系统的生产率。