Invention Application
- Patent Title: ELECTRODE WITH INCREASED STABILITY AND METHOD OF MANUFACTURING THE SAME
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Application No.: PCT/US2007/014332Application Date: 2007-06-19
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Publication No.: WO2007149465A3Publication Date: 2007-12-27
- Inventor: ZHOU, Dao, Min , OK, Jerry , TALBOT, Neil, Hamilton , MECH, Brian, V. , LITTLE, James , GREENBERG, Robert, J.
- Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC. , ZHOU, Dao, Min , OK, Jerry , TALBOT, Neil, Hamilton , MECH, Brian, V. , LITTLE, James , GREENBERG, Robert, J.
- Applicant Address: 12744 San Fernando Road, Building 3 Sylmar, CA 91342 US
- Assignee: SECOND SIGHT MEDICAL PRODUCTS, INC.,ZHOU, Dao, Min,OK, Jerry,TALBOT, Neil, Hamilton,MECH, Brian, V.,LITTLE, James,GREENBERG, Robert, J.
- Current Assignee: SECOND SIGHT MEDICAL PRODUCTS, INC.,ZHOU, Dao, Min,OK, Jerry,TALBOT, Neil, Hamilton,MECH, Brian, V.,LITTLE, James,GREENBERG, Robert, J.
- Current Assignee Address: 12744 San Fernando Road, Building 3 Sylmar, CA 91342 US
- Agency: LENDVAI, Tomas et al.
- Priority: US60/814,976 20060619; US60/815,037 20060619
- Main IPC: A61N1/05
- IPC: A61N1/05 ; A61N1/36
Abstract:
The present invention provides an implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts. The present invention provides an implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material. The present invention provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer. The present invention provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying a polymer layer on the metal layer; applying photoresist layer on the polymer layer; patterning the photoresist layer providing openings; electroplating the openings with metal; and removing the photoresist layer.
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