Invention Application
WO2016140819A2 SYSTEM IN PACKAGE FAN OUT STACKING ARCHITECTURE AND PROCESS FLOW
审中-公开
封装中的系统扇出架构和工艺流程
- Patent Title: SYSTEM IN PACKAGE FAN OUT STACKING ARCHITECTURE AND PROCESS FLOW
- Patent Title (中): 封装中的系统扇出架构和工艺流程
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Application No.: PCT/US2016/018804Application Date: 2016-02-19
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Publication No.: WO2016140819A2Publication Date: 2016-09-09
- Inventor: ZHAI, Jun , HU, Kunzhong , LAI, Kwan-Yu , PANG, Mengzhi , ZHONG, Chonghua , YANG, Se Young
- Applicant: APPLE INC.
- Applicant Address: 1 Infinite Loop Cupertino, California 95014 US
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: 1 Infinite Loop Cupertino, California 95014 US
- Agency: SCHELLER, James C. et al.
- Priority: US14/638,925 20150304
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/56 ; H01L23/538
Abstract:
Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), and a plurality of die attached to the front and back side of the first RDL. The first and second RDLs are coupled together with a plurality of conductive pillars extending from the back side of the first RDL to a front side of the second RDL.
Information query
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