Invention Application
WO2016168231A1 DIAMOND-BASED SLURRIES WITH IMPROVED SAPPHIRE REMOVAL RATE AND SURFACE ROUGHNESS
审中-公开
具有改进的SAPPHIRE去除速率和表面粗糙度的基于钻石的液晶
- Patent Title: DIAMOND-BASED SLURRIES WITH IMPROVED SAPPHIRE REMOVAL RATE AND SURFACE ROUGHNESS
- Patent Title (中): 具有改进的SAPPHIRE去除速率和表面粗糙度的基于钻石的液晶
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Application No.: PCT/US2016/027189Application Date: 2016-04-13
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Publication No.: WO2016168231A1Publication Date: 2016-10-20
- Inventor: PANDEY, Prativa , REISS, Brian , WHITE, Michael
- Applicant: CABOT MICROELECTRONICS CORPORATION
- Applicant Address: 870 North Commons Drive Aurora, Illinois 60504 US
- Assignee: CABOT MICROELECTRONICS CORPORATION
- Current Assignee: CABOT MICROELECTRONICS CORPORATION
- Current Assignee Address: 870 North Commons Drive Aurora, Illinois 60504 US
- Agency: OMHOLT, Thomas
- Priority: US62/146,713 20150413
- Main IPC: H01L21/304
- IPC: H01L21/304 ; B24B37/24
Abstract:
The invention provides a chemical-mechanical polishing composition and a method of chemically-mechanically polishing a sapphire substrate. The composition contains a diamond abrasive and a pH adjuster. The method involves contacting the substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.
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