公开(公告)号：WO2016094028A1

公开(公告)日：2016-06-16

申请号：PCT/US2015/060522

申请日：2015-11-13

Applicant: CABOT MICROELECTRONICS CORPORATION

Inventor： PALLIKKARA KUTTIATOOR, Sudeep ,  DOCKERY, Kevin ,  PANDEY, Prativa ,  JIA, Renhe

IPC: C09K3/14 ,  H01L21/304

CPC classification number: C09G1/02 ,  C03C15/00 ,  C23F1/16 ,  H01L21/31053 ,  H01L21/31111 ,  H01L21/76224

Abstract: The invention provides a chemical-mechanical polishing composition containing abrasive, an ionic polymer of formula (I) wherein X 1 and X 2 , Z 1 and Z 2 , R 1 , R 2 , R 3 and R 4 , and n are as defined herein, a polyhydroxy aromatic compound, a polyvinyl alcohol, and water, wherein the polishing composition has a pH of about 1 to about 4.5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains silicon oxide, silicon nitride, and/or polysilicon.

Abstract translation: 本发明提供一种含有研磨剂，式（I）的离子聚合物的化学机械抛光组合物，其中X1和X2，Z1和Z2，R1，R2，R3和R4和n如本文所定义，多羟基芳族化合物， 聚乙烯醇和水，其中抛光组合物的pH为约1至约4.5。 本发明还提供了利用本发明的化学 - 机械抛光组合物对衬底进行化学机械抛光的方法。 通常，衬底含有氧化硅，氮化硅和/或多晶硅。

公开(公告)号：WO2016168231A1

公开(公告)日：2016-10-20

申请号：PCT/US2016/027189

申请日：2016-04-13

Applicant: CABOT MICROELECTRONICS CORPORATION

Inventor： PANDEY, Prativa ,  REISS, Brian ,  WHITE, Michael

IPC: H01L21/304 ,  B24B37/24

CPC classification number: C09G1/02 ,  B24B37/044 ,  C09G1/04 ,  C09G1/06 ,  C09K3/1409 ,  C09K3/1463 ,  C09K13/06 ,  H01L21/30625 ,  H01L21/3212 ,  H01L21/76898

Abstract: The invention provides a chemical-mechanical polishing composition and a method of chemically-mechanically polishing a sapphire substrate. The composition contains a diamond abrasive and a pH adjuster. The method involves contacting the substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.

Abstract translation: 本发明提供化学机械抛光组合物和化学机械抛光蓝宝石衬底的方法。 该组合物含有金刚石研磨剂和pH调节剂。 该方法包括使基底与抛光垫和化学 - 机械抛光组合物接触，使抛光垫和抛光组合物相对于基底移动，并研磨基底的至少一部分以抛光基底。

公开(公告)号：WO2017044340A1

公开(公告)日：2017-03-16

申请号：PCT/US2016/049299

申请日：2016-08-29

Applicant: CABOT MICROELECTRONICS CORPORATION

Inventor： PANDEY, Prativa ,  CHANG, Juyeon ,  REISS, Brian

IPC: C09K3/14 ,  C09G1/04

CPC classification number: B24B37/044 ,  C08K2003/2213 ,  C09G1/02

Abstract: The invention provides a chemical mechanical polishing composition comprising, consisting essentially of, or consisting of (a) about 0.01 wt.% to about 1 wt.% of wet process ceria, (b) about 10 ppm to about 200 ppm of a cationic polymer comprising quaternary amino groups, (c) about 10 ppm to about 2000 ppm of a non fluorinated nonionic surfactant, (d) an amino acid, and (e) water, wherein the polishing composition has a pH of about 3 to about 8. The invention further provides a method of polishing a substrate with the polishing composition.

Abstract translation: 本发明提供一种化学机械抛光组合物，其包含（a）约0.01重量％至约1重量％的湿法氧化铈，（b）约10ppm至约200ppm的阳离子聚合物 包括季氨基，（c）约10ppm至约2000ppm的非氟化非离子表面活性剂，（d）氨基酸和（e）水，其中所述抛光组合物具有约3至约8的pH。 本发明还提供了用抛光组合物抛光衬底的方法。