Invention Application
WO2016200534A1 LEAD FRAME WITH CONDUCTIVE CLIP FOR MOUNTING A SEMICONDUCTOR DIE WITH REDUCED CLIP SHIFTING
审中-公开
带有导电夹片的导轨框架，用于安装半导体夹具，减少夹子移位
- Patent Title: LEAD FRAME WITH CONDUCTIVE CLIP FOR MOUNTING A SEMICONDUCTOR DIE WITH REDUCED CLIP SHIFTING
- Patent Title (中): 带有导电夹片的导轨框架，用于安装半导体夹具，减少夹子移位
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Application No.: PCT/US2016/031761Application Date: 2016-05-11
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Publication No.: WO2016200534A1Publication Date: 2016-12-15
- Inventor: DING, Hui-Ying , WANG, Pengnian , YU, Tao , LIU, Jun-Feng , BAI, Jun-Kai , PENG, Chih-Ping
- Applicant: VISHAY GENERAL SEMICONDUCTOR LLC
- Applicant Address: 150 Motor Parkway Hauppauge, NY 11788 US
- Assignee: VISHAY GENERAL SEMICONDUCTOR LLC
- Current Assignee: VISHAY GENERAL SEMICONDUCTOR LLC
- Current Assignee Address: 150 Motor Parkway Hauppauge, NY 11788 US
- Agency: MAYER, Stuart, H. et al.
- Priority: US14/735,229 20150610
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/433 ; H01L23/31 ; H01L23/64 ; H01L33/48
Abstract:
A semiconductor assembly includes a semiconductor die comprising lower and upper electrical contacts. A lead frame having a lower die pad is electrically and mechanically connected to the lower electrical contact of the die. An upper conductive member has a first portion electrically and mechanically connected to the upper electrical contact of the die. A lead terminal has a surface portion electrically and mechanically connected to a second portion of the conductive member. The surface portion of the lead terminal and/or the second portion of the conductive member has a series of grooves disposed therein. Packaging material encapsulates the semiconductor die, at least a portion of the lead frame, at least a portion of the upper conducive member and at least a portion of the lead terminal.
Information query
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