公开(公告)号：WO2016200534A1

公开(公告)日：2016-12-15

申请号：PCT/US2016/031761

申请日：2016-05-11

Applicant: VISHAY GENERAL SEMICONDUCTOR LLC

Inventor： DING, Hui-Ying ,  WANG, Pengnian ,  YU, Tao ,  LIU, Jun-Feng ,  BAI, Jun-Kai ,  PENG, Chih-Ping

IPC: H01L23/495 ,  H01L23/433 ,  H01L23/31 ,  H01L23/64 ,  H01L33/48

CPC classification number: H01L23/49575 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49517 ,  H01L2021/6027 ,  H01L2021/60277 ,  H01L2224/33 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor assembly includes a semiconductor die comprising lower and upper electrical contacts. A lead frame having a lower die pad is electrically and mechanically connected to the lower electrical contact of the die. An upper conductive member has a first portion electrically and mechanically connected to the upper electrical contact of the die. A lead terminal has a surface portion electrically and mechanically connected to a second portion of the conductive member. The surface portion of the lead terminal and/or the second portion of the conductive member has a series of grooves disposed therein. Packaging material encapsulates the semiconductor die, at least a portion of the lead frame, at least a portion of the upper conducive member and at least a portion of the lead terminal.

Abstract translation: 半导体组件包括包括下电极和上电触头的半导体管芯。 具有下管芯焊盘的引线框架电连接和机械连接到管芯的下电触头。 上导电构件具有电和机械地连接到管芯的上电接触件的第一部分。 引线端子具有电气和机械连接到导电构件的第二部分的表面部分。 引线端子的表面部分和/或导电部件的第二部分具有设置在其中的一系列凹槽。 包装材料封装半导体管芯，引线框架的至少一部分，上部导电构件的至少一部分和引线端子的至少一部分。