- 专利标题： SEMICONDUCTOR HOUSING FOR PARTIALLY ENCLOSING A SEMICONDUCTOR DIE, INTERMEDIATE PRODUCT AND METHOD OF MANUFACTURING THE SAME
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申请号： PCT/EP2019/085883申请日： 2019-12-18
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公开(公告)号： WO2020127442A3公开(公告)日： 2020-06-25
- 发明人: BECKER, Martin , RUDZKI, Jacek , EISELE, Ronald , OSTERWALD, Frank , BASTOS ABIBE, André
- 申请人： DANFOSS SILICON POWER GMBH
- 申请人地址： Husumer Strasse 251 24941 Flensburg DE
- 专利权人： DANFOSS SILICON POWER GMBH
- 当前专利权人： DANFOSS SILICON POWER GMBH
- 当前专利权人地址： Husumer Strasse 251 24941 Flensburg DE
- 代理机构： STEVENS, Brian
- 优先权： DE10 20181220
- 主分类号： H01L23/49
- IPC分类号： H01L23/49 ; H01L23/492 ; H01L21/60
摘要：
A semiconductor module having a semiconductor and a housing (100) enclosing the semiconductor, wherein the housing is made of an electrically conductive material and has a recess (30) occupied by the semiconductor, wherein the side of the semiconductor opposite the recess (30) is coplanar with the surface of the housing (100) having the recess (30). The housing (100) may have an opening which communicates with the recess (30) to make the control terminal of the semiconductor accessible from outside the housing (100). The control terminal may be connected to the corresponding control terminal on a substrate (200) through a bond wire (300).
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