Invention Application
- Patent Title: EMBEDDED BONDED ASSEMBLY AND METHOD FOR MAKING THE SAME
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Application No.: PCT/US2020/026106Application Date: 2020-04-01
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Publication No.: WO2021040809A1Publication Date: 2021-03-04
- Inventor: WU, Chen , RABKIN, Peter , CHEN, Yangyin , HIGASHITANI, Masaaki
- Applicant: SANDISK TECHNOLOGIES LLC
- Applicant Address: 5080 Spectrum Drive, Suite 1050W
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: 5080 Spectrum Drive, Suite 1050W
- Agency: RADOMSKY, Leon et al.
- Priority: US16/552,089 2019-08-27
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/48 ; H01L23/00 ; H01L27/1157 ; H01L27/11573 ; H01L27/11582 ; H01L27/11524 ; H01L27/11529 ; H01L27/11556
Abstract:
A semiconductor structure includes a first semiconductor die containing a recesses, and a second semiconductor die which is embedded in the recess in the first semiconductor die and is bonded to the first semiconductor die.
Information query
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