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    System for transporting substrate carriers
    2.
    发明公开
    System for transporting substrate carriers 有权
    运输基板载体的系统

    公开(公告)号：EP1394840A2

    公开(公告)日：2004-03-03

    申请号：EP03255404.0

    申请日：2003-08-29

    申请人： Applied Materials, Inc.

    发明人： Rice, Michael R ,  Hudgens, Jeffrey C. ,  Englhardt, Eric A. ,  Lowrance, Robert B. ,  Elliott, Martin R.

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67769 ,  H01L21/67775 ,  H01L21/67778

    摘要： In a semiconductor fabrication facility, a conveyor (12) transports substrates carriers (14). The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism (32) lifts the substrate carriers (14) from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor.

    摘要翻译： 在半导体制造设施中，传送机（12）传送基板载体（14）。 衬底载具从输送机上卸载并装载到输送机上而不停止输送机。 在卸载操作期间，加载和/或卸载机构（32）将基板载体（14）从输送机提升，同时匹配输送机的水平速度。 类似地，在装载操作期间，装载/卸载机构降低基板载体与输送机接合，同时与输送机的水平速度匹配。 不带载体的各个基板可以类似地从传送机装载和/或卸载。

    Apparatus and method for substrate processing
    3.
    发明公开
    Apparatus and method for substrate processing 失效
    Vorrichtung und Verfahren zur Bearbeitung von Substraten

    公开(公告)号：EP0688888A2

    公开(公告)日：1995-12-27

    申请号：EP95304139.9

    申请日：1995-06-15

    申请人： APPLIED MATERIALS, INC.

    发明人： Lei, Lawrence Chung-lai ,  Leung, Cissy S. ,  Englhardt, Eric A. ,  Sinha, Ashok K.

    IPC分类号： C23C16/44 ,  C23C16/52 ,  H01L21/00 ,  C30B25/12

    CPC分类号： C23C16/45521 ,  C23C16/4585 ,  C30B25/14 ,  H01L21/6838

    摘要： The disclosure relates to a substrate processing apparatus (10) for processing a substrate (20) having a peripheral edge, an upper surface for processing and a lower surface lying on a support (16). The apparatus includes a processing chamber (14) which houses the substrate support, in the form of a heater pedestal including a substrate receiving surface (22) for receiving the lower surface of the substrate. A circumscribing shadow ring (24) is located around the pedestal to cover peripheral edge portion of the substrate. The shadow ring also defines a cavity (70) between itself and the pedestal, at the peripheral edge of the substrate. In operation, the chamber receives processing gas at a first pressure and purge gas is introduced into the cavity, between the ring and the pedestal, at a second pressure which is greater than the first pressure. Fluid conduits (50) are provided to enhance the flow of the purge gas away from the peripheral edge of the substrate.

    摘要翻译： 本公开涉及一种用于处理具有周边边缘的基板（20），用于加工的上表面和位于支撑件（16）上的下表面）的基板处理装置（10）。 该装置包括处理室（14），该处理室以加热器底座的形式容纳衬底支撑件，该加热器基座包括用于接收衬底的下表面的衬底接收表面（22）。 外围的阴影环（24）位于基座周围以覆盖基板的周缘部分。 阴影环还在基板的周缘处在其与基座之间限定一个空腔（70）。 在操作中，腔室以第一压力接收处理气体，并且吹扫气体以大于第一压力的第二压力被引入腔室中的空腔中。 提供流体导管（50）以增强净化气体远离基板周边的流动。

    Apparatus and method for substrate processing
    5.
    发明公开
    Apparatus and method for substrate processing 失效
    用于基板处理的设备和方法

    公开(公告)号：EP0688888A3

    公开(公告)日：1998-02-04

    申请号：EP95304139.9

    申请日：1995-06-15

    申请人： APPLIED MATERIALS, INC.

    发明人： Lei, Lawrence Chung-lai ,  Leung, Cissy S. ,  Englhardt, Eric A. ,  Sinha, Ashok K.

    IPC分类号： C23C16/44 ,  C23C16/52 ,  H01L21/00 ,  C30B25/12

    CPC分类号： C23C16/45521 ,  C23C16/4585 ,  C30B25/14 ,  H01L21/6838

    摘要： The disclosure relates to a substrate processing apparatus (10) for processing a substrate (20) having a peripheral edge, an upper surface for processing and a lower surface lying on a support (16). The apparatus includes a processing chamber (14) which houses the substrate support, in the form of a heater pedestal including a substrate receiving surface (22) for receiving the lower surface of the substrate. A circumscribing shadow ring (24) is located around the pedestal to cover peripheral edge portion of the substrate. The shadow ring also defines a cavity (70) between itself and the pedestal, at the peripheral edge of the substrate. In operation, the chamber receives processing gas at a first pressure and purge gas is introduced into the cavity, between the ring and the pedestal, at a second pressure which is greater than the first pressure. Fluid conduits (50) are provided to enhance the flow of the purge gas away from the peripheral edge of the substrate.

    摘要翻译： 本发明涉及一种用于处理具有外围边缘，用于处理的上表面和位于支撑件（16）上的下表面的基板（20）的基板处理设备（10）。 该设备包括以加热器基座的形式容纳基板支撑件的处理腔室（14），该加热器基座包括用于接收基板的下表面的基板接收表面（22）。 外接阴影环（24）位于基座周围以覆盖基板的外围边缘部分。 遮蔽环还在衬底的外围边缘处限定其本身与底座之间的空腔（70）。 在操作中，腔室以第一压力接收处理气体，并且在大于第一压力的第二压力下将净化气体引入腔室中的环和基座之间。 提供流体管道（50）以增强吹扫气体远离衬底的外围边缘的流动。

    System for transporting substrate carriers
    6.
    发明公开
    System for transporting substrate carriers 审中-公开
    系统zum Transportieren vonSubstratträgern

    公开(公告)号：EP2019417A1

    公开(公告)日：2009-01-28

    申请号：EP08018060.7

    申请日：2003-08-29

    申请人： Applied Materials, Inc.

    发明人： Rice, Michael R. ,  Hudgens, Jeffrey C. ,  Englhardt, Eric A. ,  Lowrance, Robert B. ,  Elliott, Martin R.

    IPC分类号： H01L21/00 ,  H01L21/68 ,  B65G49/07

    CPC分类号： H01L21/67769 ,  H01L21/67775 ,  H01L21/67778

    摘要： In a semiconductor fabrication facility, a conveyor (12) transports substrates carriers (14). The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism (32) lifts the substrate carriers (14) from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor.

    摘要翻译： 在半导体制造设备中，输送机（12）输送基板载体（14）。 基板载体从输送机卸载并装载到输送机上而不停止输送机。 负载和/或卸载机构（32）在卸载操作期间将基板载体（14）从输送机提升，同时匹配输送机的水平速度。 类似地，在装载操作期间，装载/卸载机构降低了基板载体与输送机的接合，同时匹配输送机的水平速度。 没有载体的单个基材可以类似地从输送机装载和/或卸载。

    Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
    9.
    发明公开
    Substrate carrier handler that unloads substrate carriers directly from a moving conveyor 审中-公开
    对于衬底保持器谁衬底支架直接从移动的传送带放电处理装置

    公开(公告)号：EP1396874A2

    公开(公告)日：2004-03-10

    申请号：EP03255382.8

    申请日：2003-08-29

    申请人： Applied Materials, Inc.

    发明人： Rice, Michael R. ,  Hudgens, Jeffrey C. ,  Englhardt, Eric A. ,  Lowrance, Robert B. ,  Elliott, Martin R.

    IPC分类号： H01L21/00

    CPC分类号： B65G37/02 ,  B65G47/61 ,  B65G2201/0297 ,  H01L21/67769 ,  H01L21/67775 ,  H01L21/67778

    摘要： In a first aspect, a substrate loading station (201) is served by a conveyor (231) which continuously transports substrate carriers (207). A substrate carrier handler (215) that is part of the substrate loading station (201) operates to exchange substrate carriers with the conveyor while the conveyor is in motion. A carrier exchange procedure may include moving an end effector (225) of the substrate carrier handler at a velocity that substantially matches a velocity of the conveyor. Numerous other aspects are provided.

    摘要翻译： 在第一方面中，一个基片装载站（201）由传送装置（231），它连续地输送基片的载体（207）提供服务。 载体基板处理程序（215）确实是在基板装载站（201）的一部分进行操作，以与输送机交换衬底载波，而在输送机是在运动中。 载体交换过程可以包括移动以速度确实基本上输送机的速度相匹配，以结束基板载体处理程序的执行器（225）。 还提供了许多其他方面。