公开(公告)号：EP1975996A3

公开(公告)日：2012-08-08

申请号：EP08010509.1

申请日：2004-01-27

申请人： Applied Materials, Inc.

发明人： Rice, Michael R. ,  Lowrance, Robert B. ,  Elliott, Martin R. ,  Hudgens, Jeffrey ,  Englhardt, Eric Andrew

IPC分类号： H01L21/677

CPC分类号： H01L21/67706 ,  B65G17/20 ,  B65G37/02 ,  B65G2201/0297 ,  H01L21/67727 ,  H01L21/6773 ,  H01L21/67769 ,  H01L21/67778 ,  Y10S414/135

摘要： According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop along at least a portion of the semiconductor device manufacturing facility. The ribbon is adapted to (1) be flexible in a horizontal plane and rigid in a vertical plane; and (2) transport a plurality of substrate carriers within at least a portion of the semiconductor device manufacturing facility. Numerous other aspects are provided, as are systems, methods and computer program products in accordance with these and other aspects.

公开(公告)号：EP1975996A2

公开(公告)日：2008-10-01

申请号：EP08010509.1

申请日：2004-01-27

申请人： Applied Materials, Inc.

发明人： Rice, Michael R. ,  Lowrance, Robert B. ,  Elliott, Martin R. ,  Hudgens, Jeffrey ,  Englhardt, Eric Andrew

IPC分类号： H01L21/677

CPC分类号： H01L21/67706 ,  B65G17/20 ,  B65G37/02 ,  B65G2201/0297 ,  H01L21/67727 ,  H01L21/6773 ,  H01L21/67769 ,  H01L21/67778 ,  Y10S414/135

摘要： According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop along at least a portion of the semiconductor device manufacturing facility. The ribbon is adapted to (1) be flexible in a horizontal plane and rigid in a vertical plane; and (2) transport a plurality of substrate carriers within at least a portion of the semiconductor device manufacturing facility. Numerous other aspects are provided, as are systems, methods and computer program products in accordance with these and other aspects.

摘要翻译： 根据第一方面，提供了一种适于在半导体器件制造设备内输送衬底载体的第一传送系统。 第一输送机系统包括沿半导体器件制造设备的至少一部分形成闭环的带状物。 该带适于（1）在水平面上具有柔性并且在垂直平面中是刚性的; 和（2）在半导体器件制造设备的至少一部分内传输多个衬底载体。 还提供了许多其他方面，以及根据这些和其它方面的系统，方法和计算机程序产品。

公开(公告)号：EP1394840B1

公开(公告)日：2008-11-19

申请号：EP03255404.0

申请日：2003-08-29

申请人： APPLIED MATERIALS, INC.

发明人： Rice, Michael R. ,  Hudgens, Jeffrey C. ,  Englhardt, Eric A. ,  Lowrance, Robert B. ,  Elliott, Martin R.

IPC分类号： H01L21/00 ,  H01L21/68 ,  B65G49/07

CPC分类号： H01L21/67769 ,  H01L21/67775 ,  H01L21/67778

公开(公告)号：EP1750299A3

公开(公告)日：2007-06-13

申请号：EP06022299.9

申请日：2004-01-27

申请人： Applied Materials, Inc.

发明人： Rice, Michael R. ,  Lowrance, Robert B. ,  Elliott, Martin R. ,  Hudgens, Jeffrey C. ,  Englhardt Eric Andrew

IPC分类号： H01L21/00 ,  H01L21/677

CPC分类号： H01L21/67769 ,  H01L21/67778

摘要： According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop along at least a portion of the semiconductor device manufacturing facility. The ribbon is adapted to (1) be flexible in a horizontal plane and rigid in a vertical plane; and (2) transport a plurality of substrate carriers within at least a portion of the semiconductor device manufacturing facility. Numerous other aspects are provided, as are systems, methods and computer program products in accordance with these and other aspects.

公开(公告)号：EP1396874A3

公开(公告)日：2005-01-12

申请号：EP03255382.8

申请日：2003-08-29

申请人： Applied Materials, Inc.

发明人： Rice, Michael R. ,  Hudgens, Jeffrey C. ,  Englhardt, Eric A. ,  Lowrance, Robert B. ,  Elliott, Martin R.

IPC分类号： H01L21/00 ,  H01L21/68 ,  B65G49/07

CPC分类号： B65G37/02 ,  B65G47/61 ,  B65G2201/0297 ,  H01L21/67769 ,  H01L21/67775 ,  H01L21/67778

摘要： In a first aspect, a substrate loading station (201) is served by a conveyor (231) which continuously transports substrate carriers (207). A substrate carrier handler (215) that is part of the substrate loading station (201) operates to exchange substrate carriers with the conveyor while the conveyor is in motion. A carrier exchange procedure may include moving an end effector (225) of the substrate carrier handler at a velocity that substantially matches a velocity of the conveyor. Numerous other aspects are provided.

公开(公告)号：EP2019417A1

公开(公告)日：2009-01-28

申请号：EP08018060.7

申请日：2003-08-29

申请人： Applied Materials, Inc.

发明人： Rice, Michael R. ,  Hudgens, Jeffrey C. ,  Englhardt, Eric A. ,  Lowrance, Robert B. ,  Elliott, Martin R.

IPC分类号： H01L21/00 ,  H01L21/68 ,  B65G49/07

CPC分类号： H01L21/67769 ,  H01L21/67775 ,  H01L21/67778

摘要： In a semiconductor fabrication facility, a conveyor (12) transports substrates carriers (14). The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism (32) lifts the substrate carriers (14) from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor.

摘要翻译： 在半导体制造设备中，输送机（12）输送基板载体（14）。 基板载体从输送机卸载并装载到输送机上而不停止输送机。 负载和/或卸载机构（32）在卸载操作期间将基板载体（14）从输送机提升，同时匹配输送机的水平速度。 类似地，在装载操作期间，装载/卸载机构降低了基板载体与输送机的接合，同时匹配输送机的水平速度。 没有载体的单个基材可以类似地从输送机装载和/或卸载。

公开(公告)号：EP1750299B1

公开(公告)日：2008-06-11

申请号：EP06022299.9

申请日：2004-01-27

申请人： Applied Materials, Inc.

发明人： Rice, Michael R. ,  Lowrance, Robert B. ,  Elliott, Martin R. ,  Hudgens, Jeffrey C. ,  Englhardt Eric Andrew

IPC分类号： H01L21/00 ,  H01L21/677

CPC分类号： H01L21/67769 ,  H01L21/67778

公开(公告)号：EP1990103A1

公开(公告)日：2008-11-12

申请号：EP08155806.6

申请日：2008-05-07

申请人： Applied Materials, Inc.

发明人： Collins, Kenneth S. ,  Hanawa, Hiroji ,  Nguyen, Andrew ,  Rauf, Shahid ,  Balakrishna, Ajit ,  Todorow, Valentin N. ,  Ramaswamy, Kartik ,  Salinas, Martin J. ,  Yousif, Imad ,  Merry, Walter R. ,  Rui, Ying ,  Rice, Michael R.

IPC分类号： B08B7/00 ,  H01J37/32 ,  H01L21/00

CPC分类号： B08B7/00 ,  B08B7/0035 ,  H01J37/32357 ,  H01J37/3244 ,  H01L21/0206 ,  H01L21/02063 ,  H01L21/0209 ,  H01L21/67069 ,  H01L21/67115 ,  H01L21/68764

摘要： A process is provided for removing polymer from a backside of a workpiece 118 and/or photoresist from a front side of the workpiece 118. For backside polymer removal, the wafer 118 is positioned near the ceiling 104 to above a localized or remote plasma source 500 having a side outlet through the sidewall 102 of the chamber, and backside polymer is removed by rotating the workpiece 118 while flowing plasma by-products from the side outlet to the wafer backside. For front side photoresist removal, the wafer is positioned away from the ceiling 104 and below the side outlet of the localized plasma source 500, and front side photoresist is removed by rotating the workpiece 118 while flowing plasma by-products from the side outlet to the wafer front side.

摘要翻译： 提供了用于从工件118的前侧从工件118和/或光致抗蚀剂的背面去除聚合物的方法。为了进行背侧聚合物的去除，晶片118位于天花板104附近，位于局部或远程等离子体源500 具有通过室的侧壁102的侧出口，并且通过在从侧出口到晶片背面的等离子体副产物流动的同时旋转工件118来去除背侧聚合物。 对于前侧光致抗蚀剂去除，晶片定位成远离天花板104并位于局部等离子体源500的侧出口下方，并且通过旋转工件118同时将等离子体副产物从侧出口流到 晶圆正面。

公开(公告)号：EP1750299A2

公开(公告)日：2007-02-07

申请号：EP06022299.9

申请日：2004-01-27

申请人： Applied Materials, Inc.

发明人： Rice, Michael R. ,  Lowrance, Robert B. ,  Elliott, Martin R. ,  Hudgens, Jeffrey C. ,  Englhardt Eric Andrew

IPC分类号： H01L21/677

CPC分类号： H01L21/67769 ,  H01L21/67778

摘要： According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop along at least a portion of the semiconductor device manufacturing facility. The ribbon is adapted to (1) be flexible in a horizontal plane and rigid in a vertical plane; and (2) transport a plurality of substrate carriers within at least a portion of the semiconductor device manufacturing facility. Numerous other aspects are provided, as are systems, methods and computer program products in accordance with these and other aspects.

摘要翻译： 根据第一方面，提供了一种适于在半导体器件制造设备内输送衬底载体的第一传送系统。 第一输送机系统包括沿半导体器件制造设备的至少一部分形成闭环的带状物。 该带适于（1）在水平面上具有柔性并且在垂直平面中是刚性的; 和（2）在半导体器件制造设备的至少一部分内传输多个衬底载体。 还提供了许多其他方面，以及根据这些和其他方面的系统，方法和计算机程序产品。

公开(公告)号：EP1450399A1

公开(公告)日：2004-08-25

申请号：EP04250423.3

申请日：2004-01-27

申请人： Applied Materials, Inc.

发明人： Rice, Michael R. ,  Elliott, Martin R. ,  Lowrance Robert B ,  Hudgens, Jeffrey C ,  Englhardt,Eric Andrew

IPC分类号： H01L21/68

CPC分类号： H01L21/6773 ,  H01L21/67733 ,  H01L21/67769 ,  H01L21/67778

摘要： In a first aspect, a first apparatus is provided for use in supporting a substrate carrier. The first apparatus includes an overhead transfer flange adapted to couple to a substrate carrier body and an overhead carrier support. The overhead transfer flange has a first side and a second side opposite the first side that is wider than the first side. Numerous other aspects are provided.

摘要翻译： 在第一方面，提供了一种用于支撑衬底载体的第一装置。 第一装置包括适于联接到衬底载体主体和架空托架支架的架空输送凸缘。 架空输送法兰具有比第一侧宽的第一侧和与第一侧相对的第二侧。 提供了许多其他方面。