摘要:
A memory cell (10, 50), suitable for electrically erasable programmable read only memories (EEPROMs), which has direct write cell capability is disclosed. The memory cell (10, 50) is fabricated on a substrate (12, 52) and uses an inversion source gate (18, 54) disposed above the substrate (12, 52) to generate a depletion source (IS) therein. The depletion source (IS) defines a channel region in the substrate (12, 52) with an associated drain (14, ID). An electrically isolated floating gate (26, 62) is disposed above the substrate (12, 52) so as to overlap at least a portion of the substrate channel region. Further, a program gate (30, 66) is disposed to overlap a portion of the floating gate (26, 62) and an access gate (34, 70) is also provided aligned at least partially over the substrate channel region such that a dual gate device is defined. An array of such memory cells (10, 50) is also disclosed.
摘要:
A non-volatile dynamic memory cell in which the non-volatile element has two different areas for electron injection, such that direct overwriting of previously stored non-volatile data is permitted without an intervening erase cycle. The non-volatile storage element is a floating gate electrode (16) which has dual contro gates (24, 26) disposed thereon. Each control gate (24, 261 includes a layer (20A, 20B) of dual electron injector structure (DEIS) material and a polysilicon layer. When writing a "0" from the volatile storage capacitor (20,14A, 26) to the floating gate (16), one of the control gates (24, 26) removes charge from the floating gate (16). To write a "1", the other control gate injects charge into the floating gate (16). The above charge transfer does not take place if the previously stored logic gate and the logic state to be written in are identical.
摘要:
A non-volatile storage cell uses two different areas (28A, 28B) for electron injection, allowing direct overwriting of previously stored data without an intervening erase cycle. A floating gate FET has duel programming gates (PG1, PG2) disposed on its floating gate (22). Each programming gate (PG1, PG2) includes n layer (28A, 28B) of dual electron injector structure (DEIS) and a polysilicon electrode (30, 32). When writing a "0", one of the programming gates PG1, PG2) removes charge from the floating gate (22). When writing "1", the other programming gate injects charge into the floating gate (22). This charge transfer does not take place if the previously stored logic state and the logic state to be written in are identical.
摘要:
The invention provides a method for electrically connecting a polysilicon-filled trench (12) to a diffusion region (10) in a semiconductor device, wherein the trench (12) and diffusion region (10) are separated by a dielectric (14). The method provides for formation of a strap or bridge contact by utilizing a diffusion barrier layer (18) which prevents diffusion into an overlying polysilicon layer (32) when a subsequent boron (16) out-diffusion step is performed. Selective etching is then utilized to remove the polysilicon layer (32) where no boron has diffused, leaving a polysilicon strap connecting the trench and diffusion region.
摘要:
A non-volatile dynamic memory cell in which the non-volatile element has two different areas for electron injection, such that direct overwriting of previously stored non-volatile data is permitted without an intervening erase cycle. The non-volatile storage element is a floating gate electrode (16) which has dual contro gates (24, 26) disposed thereon. Each control gate (24, 261 includes a layer (20A, 20B) of dual electron injector structure (DEIS) material and a polysilicon layer. When writing a "0" from the volatile storage capacitor (20,14A, 26) to the floating gate (16), one of the control gates (24, 26) removes charge from the floating gate (16). To write a "1", the other control gate injects charge into the floating gate (16). The above charge transfer does not take place if the previously stored logic gate and the logic state to be written in are identical.
摘要:
A memory system, particularly an electrically alterable read only memory system which includes a semiconductor substrate (10) having a diffusion region (12) therein defining one end of a channel region (14), a control plate (22, T1), a floating plate (20) separated from the channel region by a thin dielectric layer (16) and disposed between the control plate (22) and the channel region (14) and means (T1-T3) for transferring charge to and from the floating plate (22). A control gate (32) is coupled to the channel region (14) and is located between the diffusion region (12) and the floating plate (22). The control gate (32) may be connected to a word line and the diffusion region (12) may be connected to a bit/sense line. The channel region (14) is controlled by the word line and the presence or absence of charge on the floating plate (20). Thus, information may be read from a cell of the memory by detecting the presence or absence of charge stored in the inversion capacitor under the floating plate (20). The charge transfer means (T1-T3) includes an enhanced conduction insulator (24) and means (T1, T3) for applying appropriate voltages to the control plate (22) and to the control gate (32) to transfer charge to and from the floating plate (20) through the enhanced conduction insulator (24).
摘要:
The invention provides a method for electrically connecting a polysilicon-filled trench (12) to a diffusion region (10) in a semiconductor device, wherein the trench (12) and diffusion region (10) are separated by a dielectric (14). The method provides for formation of a strap or bridge contact by utilizing a diffusion barrier layer (18) which prevents diffusion into an overlying polysilicon layer (32) when a subsequent boron (16) out-diffusion step is performed. Selective etching is then utilized to remove the polysilicon layer (32) where no boron has diffused, leaving a polysilicon strap connecting the trench and diffusion region.