An epoxy-resin composition and use thereof
    4.
    发明公开
    An epoxy-resin composition and use thereof 审中-公开
    Eine Epoxidharz-Zusammensetzung und deren Verwendung

    公开(公告)号:EP0959088A3

    公开(公告)日:2001-04-04

    申请号:EP99303909.8

    申请日:1999-05-20

    IPC分类号: C08G59/68 C08G59/42 H01B3/40

    摘要: An epoxy-resin composition comprising (A) an at least bifunctional epoxy compound and/or an at least bifunctional epoxy resin, (B) an at least bifunctional ester-containing compound and/or an at least bifunctional ester-containing resin as a curing agent, 10 to 100 % of whose hydroxy groups are esterified with aliphatic or aromatic acyl groups, and (C) an accelerating agent, the accelerating agent essentially containing a phosphine oxide represented by general formula (1):    where R 1 to R 6 all of which may be the same or not are hydrogen, straight, branched or cyclic alkyl having 1 to 10 carbons or aryl or aralkyl having 6 to 10 carbons.

    摘要翻译: 一种环氧树脂组合物,其包含(A)至少双官能环氧化合物和/或至少双官能环氧树脂,(B)至少双官能含酯化合物和/或至少双官能含酯树脂作为固化 试剂,其10〜100%的羟基被脂肪族或芳香族酰基酯化,(C)促进剂,该促进剂基本上含有通式(1)表示的氧化膦:,其中R1〜R6 所有这些可以相同或不同,是具有1至10个碳的直链,支链或环状烷基或具有6至10个碳的芳基或芳烷基。

    Polymaleimide resin composition and laminate plate for semiconductor substrate using it
    6.
    发明公开
    Polymaleimide resin composition and laminate plate for semiconductor substrate using it 失效
    聚马来酰亚胺树脂和层压板与此使用的半导体衬底

    公开(公告)号:EP0842966A2

    公开(公告)日:1998-05-20

    申请号:EP97309134.1

    申请日:1997-11-13

    IPC分类号: C08G81/00 B32B5/26 H01B3/30

    摘要: A polymaleimide resin composition is herein disclosed which comprises an aromatic amino resin (1), a polymaleimide resin (2) and a bifunctional crosslinking agent as components. The bifunctional crosslinking agent is preferably selected from an aliphatic diamine compound, a 2,4-diamino-S-triazine compound, a diisocyanate compound, and an aliphatic diamine compound plus a bismaleimide compound. A laminate plate for a semiconductor substrate in which the polymaleimide resin composition is used is also disclosed.
    According to the present invention, there can be provided a thermosetting resin composition which permits the preparation of prepregs and green sheets having excellent flexibility, so that the workability and the productivity of the laminate plates can remarkably be improved.

    摘要翻译: 甲聚马来酰亚胺树脂组合物中游离缺失盘芳香族氨基树脂(1)的,它包括,一个聚马来酰亚胺树脂(2)和双官能交联剂作为组分。 所述双官能交联剂优选选自于脂族二胺化合物中,2,4-二氨基-S-三嗪化合物,二异氰酸酯化合物,以及在脂肪族二胺化合物加双马来酰亚胺化合物。 一种叠层板,其中聚马来酰亚胺树脂组合物用于游离缺失gibt盘中的半导体衬底。 。根据本发明,可以提供一种热固性树脂组合物,其允许具有优异的柔软性和预浸料坯片的制备中,所以没有作业性和层压板的生产率可显着提高。

    An epoxy-resin composition and use thereof
    7.
    发明公开
    An epoxy-resin composition and use thereof 审中-公开
    Eine Epoxidharzzusammensetzung und ihre Verwendung

    公开(公告)号:EP0953588A2

    公开(公告)日:1999-11-03

    申请号:EP99303299.4

    申请日:1999-04-28

    IPC分类号: C08G59/68 H01B3/40

    摘要: An epoxy-resin composition comprising (A) an at least bifunctional epoxy compound and/or an at least bifunctional epoxy resin, (B) a curing agent, and (C) an accelerating agent, the accelerating agent essentially containing a phosphine oxide represented by general formula (1);
       where R 1 to R 6 all of which may be the same or not are hydrogen, straight, branched or cyclic alkyl having 1 to 10 carbons or aryl or aralkyl having 6 to 10 carbons. The epoxy-resin composition can be used for sealing a semiconductor integrated circuit in the manufacture of a semiconductor device.

    摘要翻译: 一种环氧树脂组合物,其包含(A)至少双官能环氧化合物和/或至少双官能环氧树脂,(B)固化剂和(C)促进剂,所述促进剂基本上含有由 通式(1); 其中R 1至R 6全部可以相同或不同,是氢,具有1至10个碳的直链,支链或环状烷基或具有6至10个碳的芳基或芳烷基。 环氧树脂组合物可以用于半导体装置的制造中的半导体集成电路的密封。

    An epoxy-resin composition and use thereof
    9.
    发明公开
    An epoxy-resin composition and use thereof 审中-公开
    环氧树脂组合物及其用途

    公开(公告)号:EP0953588A3

    公开(公告)日:2001-04-04

    申请号:EP99303299.4

    申请日:1999-04-28

    IPC分类号: C08G59/68 H01B3/40

    摘要: An epoxy-resin composition comprising (A) an at least bifunctional epoxy compound and/or an at least bifunctional epoxy resin, (B) a curing agent, and (C) an accelerating agent, the accelerating agent essentially containing a phosphine oxide represented by general formula (1);    where R 1 to R 6 all of which may be the same or not are hydrogen, straight, branched or cyclic alkyl having 1 to 10 carbons or aryl or aralkyl having 6 to 10 carbons. The epoxy-resin composition can be used for sealing a semiconductor integrated circuit in the manufacture of a semiconductor device.