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公开(公告)号：EP3464685B1
公开(公告)日：2024-07-10
申请号：EP17803317.1
申请日：2017-05-18
IPC分类号： C25D21/12 , C25D17/00 , C25D7/12 , H01L21/288
CPC分类号： C25D21/12
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2.发明公开
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公开(公告)号：EP4239108A1
公开(公告)日：2023-09-06
申请号：EP22174790.0
申请日：2022-05-23
发明人： LIN, Xiaofa , LIN, Xiaoshan , LIU, Xiaolong , LIN, Xiaowei , PENG, Dongliang , ZHANG, Yining
IPC分类号： C25D3/06 , C25D3/12 , C25D5/14 , C25D7/00 , C25D21/12 , C25D3/34 , C25D3/56 , C25D5/00 , A01N33/12
摘要： The present application relates to a sterilizing and environment-friendly composite plating layer, a preparation method thereof and a sterilizing and environment-friendly product. The sterilizing and environment-friendly composite plating layer includes: a semi-bright nickel layer, a high-sulfur nickel layer and an environment-friendly white chromium composite sterilizing layer; the semi-bright nickel layer is adapted to be positioned on a substrate having a sterilizing requirement; the high-sulfur nickel layer is disposed on the surface of a side of the semi-bright nickel layer away from the substrate; the environment-friendly white chromium composite sterilizing layer is disposed on the surface of a side of the high-sulfur nickel layer away from the substrate; the environment-friendly white chromium composite sterilizing layer has a nano-needle structure and is formed by a composite raw material containing sterilizing ammonium salt, and the concentration of the sterilizing ammonium salt in the composite raw material is 50-100 g/L. The sterilizing and environment-friendly composite plating layer and the sterilizing and environment-friendly product of the present application can be prepared directly by an electroplating method, and can have good broad-spectrum sterilizing effect without spraying antibacterial materials containing nano Ag + , Cu 2+ , and the sterilizing effect can be directly displayed.
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4.发明公开
公开(公告)号：EP4219800A1
公开(公告)日：2023-08-02
申请号：EP22154314.3
申请日：2022-01-31
申请人： Semsysco GmbH
发明人： GLEISSNER, Andreas , HOFER, Georg
摘要： The disclosure relates to a substrate holder (S1) for holding a substrate (1) in a chemical and/or electrolytic surface treatment of the substrate (1), a substrate handling system comprising a substrate holder (S1) and an immersion scanner unit (S2) and a use of a substrate holder (S1) for holding a substrate (1) with a width in a range of 1000 to 3500 mm and a length in a range of 1000 to 4000 mm.
The substrate holder (S1) for holding a substrate (1) in a chemical and/or electrolytic surface treatment of the substrate (1) comprises a substrate carrier (2) and a power contact unit (3). The substrate carrier (2) comprises a frame (2a) to carry the substrate (1). The power contact unit (3) comprises a body (3a), a plurality of main legs (3b) extending from the body (3a) at least partially along an edge of the substrate carrier (2) and a plurality of side legs (3c) each arranged essentially perpendicular at one of the main legs (3b) to contact the substrate (1). The power contact unit (3) further comprises a plurality of retaining elements (3d) provided between the body (3a) of the power contact unit (3) and the frame (2a) of the substrate carrier (2) to keep the substrate (1) in contact with the power contact unit (3) when the substrate (1) is placed onto the substrate carrier (2).-
公开(公告)号：EP4006210A1
公开(公告)日：2022-06-01
申请号：EP20210367.7
申请日：2020-11-27
申请人： Semsysco GmbH
摘要： The disclosure relates to a distribution system (1) for a process fluid (18) and an electric current for a chemical and/or electrolytic surface treatment of a substrate (9), comprising a distribution body (2), a primary cathode (30), and a secondary cathode (3), wherein the distribution body (2) comprises several openings (4) for the process fluid (18) and the electric current, wherein the several openings (4) are arranged at a front face (10) of the distribution body (2), wherein the front face (10) is directed to the primary cathode (30), wherein the primary cathode (30) and the secondary cathode (3) are arranged to attract the electric current and to guide the electric current to the substrate (9) to be treated, wherein the secondary cathode (3) comprises several cathode pixels (13), wherein the several cathode pixels (13) are distributed in an array to be aligned with at least an area of the substrate (9) to be treated, and wherein the several cathode pixels (13) are individually controllable for adjusting a distribution of the electric current at the substrate (9). The disclosure further relates to a distribution module (14) and a distribution method (100).
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6.发明公开
公开(公告)号：EP3974561A1
公开(公告)日：2022-03-30
申请号：EP21198190.7
申请日：2021-09-22
发明人： KONDOH, Haruki , KATO, Akira , OKAMOTO, Kazuaki , KURODA, Keiji
摘要： It is determined whether an imaginary component at a predetermined frequency of an alternating current impedance is equal to or more than a preliminarily set film-formable value or not. The metallic coating is formed in a state where the substrate is pressed by the solid electrolyte membrane when the imaginary component is equal to or more than the film-formable value in the determining. The metallic coating is formed in a state where the pressing of the substrate by the solid electrolyte membrane is released to separate the solid electrolyte membrane from the substrate, the solid electrolyte membrane is re-tensioned with a constant tensile force, and subsequently, the substrate is pressed by the re-tensioned solid electrolyte membrane when the imaginary component is smaller than the film-formable value in the determining.
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公开(公告)号：EP3872236B1
公开(公告)日：2022-02-16
申请号：EP20160190.3
申请日：2020-02-28
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公开(公告)号：EP3864196A1
公开(公告)日：2021-08-18
申请号：EP19870601.2
申请日：2019-10-10
发明人： ELIYAHU, David , ELIAZ, Noam , GILEADI, Eliezer
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9.发明授权
公开(公告)号：EP3327838B1
公开(公告)日：2021-08-04
申请号：EP16830688.4
申请日：2016-06-07
发明人： KIM, Seung-Min , KIM, Dae-Young
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公开(公告)号：EP3604629B1
公开(公告)日：2021-07-21
申请号：EP19771350.6
申请日：2019-01-23
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