摘要:
To provide a front face side substrate for a heat transfer image-receiving sheet, which is possible to perform high-quality image formation on a receiving layer even when the substrate is made thinner in order to suppress the occurrence of curling, and to provide a thermal transfer image-receiving sheet having the front face side substrate for thermal transfer image-receiving sheet. The above problem is solved by a front face side substrate (10) for a thermal transfer image-receiving sheet, the front face side substrate for the thermal transfer image-receiving sheet being provided between a supporting member and a receiving layer of the thermal transfer image-receiving sheet; the front face side substrate for the thermal transfer image-receiving sheet comprising a layered structure in which a front face side layer (3) is provided on one surface of a substrate layer (2) and a rear face side layer (1) is provided on another surface of the substrate layer (2); wherein the substrate layer comprises (A) a propylene-based polymer, (B) calcium carbonate, and (C) titanium oxide, and the weight of (A) being in the range of from not less than 70 % by weight to not more than 94.5 % by weight, the weight of (B) being in the range of from not less than 5 % by weight to not more than 28 % by weight, and the weight of (C) being in the range of from not less than 0.5 % by weight to not more than 3 % by weight, based on the assumption that the total weight of (A), (B) and (C) is 100 % by weight; the front face side layer (3) comprises a modified propylene-based polymer; and the rear face side layer (1) comprises a propylene-based polymer.
摘要:
To provide a front face side substrate for a heat transfer image-receiving sheet, which is possible to perform high-quality image formation on a receiving layer even when the substrate is made thinner in order to suppress the occurrence of curling, and to provide a thermal transfer image-receiving sheet having the front face side substrate for thermal transfer image-receiving sheet. The above problem is solved by a front face side substrate (10) for a thermal transfer image-receiving sheet, the front face side substrate for the thermal transfer image-receiving sheet being provided between a supporting member and a receiving layer of the thermal transfer image-receiving sheet; the front face side substrate for the thermal transfer image-receiving sheet comprising a layered structure in which a front face side layer (3) is provided on one surface of a substrate layer (2) and a rear face side layer (1) is provided on another surface of the substrate layer (2); wherein the substrate layer comprises (A) a propylene-based polymer, (B) calcium carbonate, and (C) titanium oxide, and the weight of (A) being in the range of from not less than 70 % by weight to not more than 94.5 % by weight, the weight of (B) being in the range of from not less than 5 % by weight to not more than 28 % by weight, and the weight of (C) being in the range of from not less than 0.5 % by weight to not more than 3 % by weight, based on the assumption that the total weight of (A), (B) and (C) is 100 % by weight; the front face side layer (3) comprises a modified propylene-based polymer; and the rear face side layer (1) comprises a propylene-based polymer.
摘要:
According to the present invention, there is provided a sheet set for encapsulating a solar cell which is disposed between a light-receiving surface side protective member and a back surface side protective member, and is used for encapsulating a solar cell element and a wiring material. The sheet set for encapsulating a solar cell includes a first encapsulating material sheet disposed on a light-receiving surface side and a second encapsulating material sheet disposed on a back surface side. A storage elastic modulus (P 1 ) of the first encapsulating material sheet before a cross-linking treatment and a storage elastic modulus (P 2 ) of the second encapsulating material sheet before the cross-linking treatment satisfy a relationship of the following Expression (1), at 120°C when solid viscoelasticity is measured under conditions of a measurement temperature range of 25°C to 180°C, a frequency of 1.0 Hz, a temperature rising rate of 10°C/minute, and a shear mode. Log P 1 / P 2 > 0
摘要:
Provided is a manufacture method of a laminate film accurately precut into a desired shape. The manufactured laminate film comprises an elongated release film having thereon a plurality of insular adhesive films (A) and (B) mutually adjacent in the lengthwise direction, and the method includes: obtaining an elongated laminate having a release film and an adhesive film; precutting the adhesive film to obtain a first peeling part; and peeling off the first peeling part from the release film. The first peeling part includes peripheral parts (A1) and (B2) of insular adhesive films (A) and (B) respectively positioned at one and the other widthwise end side of the release film; and connection part (C) connecting peripheral parts (A1) and (B2), but not including peripheral parts (A2) and (B1) of insular adhesive films (A) and (B) respectively positioned at the other and the one widthwise end side of the release film.
摘要:
The laminate according to the invention is comprised of a base material (A), a silicon-containing layer (B) and a polymer layer (C) obtained from an organic acid metallic salt having a polymerizable group. The silicon-containing layer (B) and the polymer layer (C) are sequentially laminated over at least one surface of the base material (A), the silicon-containing layer (B) includes a high nitrogen concentration region comprised of silicon atoms and nitrogen atoms, silicon atoms and nitrogen atoms and oxygen atoms, or silicon atoms and nitrogen atoms and oxygen atoms and carbon atoms. The high nitrogen concentration region is formed by irradiating energy ray onto a polysilazane film formed over the base material (A) under an oxygen concentration equal to or lower than 5% and/or a relative humidity at room temperature (23°C) equal to or lower than 30% so as to denature at least a part of the film.
摘要:
There are disclosed a pair of solar battery-sealing sheets composed of a light-receiving side-sealing sheet and a backside-sealing sheet for solar electricity generating elements of a solar battery module and reducing the coming-around of the backside-sealing sheet, wherein the melt peak temperature based on a differential scanning calorimetry (DSC) of the backside-sealing sheet is higher than the melt peak temperature based on the differential scanning calorimetry (DSC) of the light-receiving side-sealing sheet; and a solar battery module using the light-receiving side-sealing sheet and the backside-sealing sheet of the solar battery-sealing sheet, and a method for manufacturing the solar battery module.
摘要:
A method for manufacturing an encapsulating material sheet for a solar battery of the invention includes a step of producing an additive-containing pellet by soaking an additive A into a pellet including a polyolefin-based resin as a main component, a step of injecting the additive-containing pellet into a cylinder (103) from a supply opening (101) in an extrusion molder (100), and melting and kneading a resin composition including the polyolefin-based resin and the additive A in the cylinder (103), and a step of molding by extrusion the resin composition from a die (109) in the extrusion molder (100) into a sheet shape.
摘要:
The present invention provides a resin sheet for solar cell encapsulation, which has excellent transparency and bonding strength for a long period of time, while being reduced in shrinkage when heated. A resin sheet for solar cell encapsulation of the present invention comprises an ethylene-vinyl acetate copolymer having a vinyl acetate content of 10-47% by mass and an organic peroxide. The ethylene-vinyl acetate copolymer contains an ethylene-vinyl acetate copolymer (EV1) which has a molecular weight distribution (Mw/Mn) of 3.0 or less. The resin sheet for solar cell encapsulation contains the organic peroxide in an amount of 0.1-5% by mass.
摘要:
A semiconductor wafer surface protecting sheet which can prevent breakage of a semiconductor wafer even when a circuit forming plane of the semiconductor wafer has a significant unevenness, and a method for protecting the semiconductor wafer by using such protecting sheet are provided. The semiconductor wafer surface protecting sheet is characterized in that the protecting sheet includes at least one resin layer (A) satisfying a relationship of G’(60)/G’(25)