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    COPPER ALLOY SHEET MATERIAL AND PROCESS FOR PRODUCING SAME
    97.
    发明公开
    COPPER ALLOY SHEET MATERIAL AND PROCESS FOR PRODUCING SAME 审中-公开
    哈佛大学医学学士学位论文

    公开(公告)号：EP2706125A1

    公开(公告)日：2014-03-12

    申请号：EP12779988.0

    申请日：2012-04-27

    申请人： Furukawa Electric Co., Ltd.

    发明人： ISOMATSU, Takemi ,  KANEKO, Hiroshi ,  SATO, Koji ,  EGUCHI, Tatsuhiko

    IPC分类号： C22C9/06 ,  C22C9/10 ,  C22F1/08 ,  H01B1/02 ,  H01B5/02 ,  H01B13/00 ,  C22F1/00

    CPC分类号： C22C9/06 ,  C22C9/10 ,  C22F1/02 ,  C22F1/08 ,  C22F1/10

    摘要： {Problems} To provide a copper alloy sheet material, which is excellent in the bending property, which has an excellent mechanical strength, which is less in anisotropy in those characteristics in the parallel direction to rolling and the perpendicular direction to rolling, and which is suitable for lead frames, connectors, terminal materials, and the like in electrical or electronic equipments, for connectors, for example, to be mounted on automotive vehicles, and for terminal materials, relays, switches, and the like.
    {Means to solve} A copper alloy sheet material, having a composition containing Ni in an amount of 1.0 mass% to 5.0 mass%, and Si in an amount of 0.1 mass% to 2.0 mass%, with the balance being copper and unavoidable impurities, wherein, in a crystal orientation analysis by an electron backscatter diffraction method, an area ratio of grains having an orientation in which a deviation from the Cube orientation {0 0 1} is within 15° is 5% to 50%, and 40 to 100 grains having the orientation in which the deviation from the Cube orientation {0 0 1} is within 15° are dispersed within 60 µm square; and a method of producing the same.

    摘要翻译： {问题}为了提供弯曲性优异的铜合金板材，其具有优异的机械强度，在轧制平行方向和垂直轧制方向上的那些特性中的各向异性较小，并且其是 适用于电气或电子设备中的引线框架，连接器，端子材料等，用于连接器，例如安装在机动车辆上，以及端子材料，继电器，开关等。 {解决方案}具有含有1.0质量％至5.0质量％的Ni的组成和0.1质量％至2.0质量％的Si的组成的铜合金板材，余量为铜和不可避免的杂质 其中，在通过电子反向散射衍射法的晶体取向分析中，具有与立方体取向{0 1} <10 0>的偏差在15°以内的取向的晶粒的面积比为5〜50 ％和40至100个具有与立方体取向{0 1} <10 0>的偏离在15°以内的取向的晶粒分散在60μm正方形内; 及其制造方法。

    Copper alloy with high strength, high electrical conductivity, and excellent bendability
    98.
    发明公开
    Copper alloy with high strength, high electrical conductivity, and excellent bendability 有权
    铜合金具有高强度，高导电性和优异的可弯曲性

    公开(公告)号：EP2426225A3

    公开(公告)日：2013-10-02

    申请号：EP11009246.7

    申请日：2007-05-23

    申请人： Kabushiki Kaisha Kobe Seiko Sho

    发明人： Aruga, Yasuhiro ,  Fugono, Akira ,  Kudo, Takeshi ,  Kajihara, Katsura

    IPC分类号： C22C9/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/10 ,  C22F1/08 ,  G01N23/04 ,  H01B1/02 ,  C22F1/00 ,  H01H1/025

    CPC分类号： H01B1/026 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01H1/025

    摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, 0.005 to 1.0% of Cr, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

    摘要翻译： 本发明涉及具有高强度，高导电率和优异的弯曲性的铜合金，所述铜合金以质量％计含有0.4〜4.0％的Ni; ，Si：0.05〜1.0％ 作为元素M，含有Cr：0.005〜1.0％，余量为铜和不可避免的杂质，其中，50〜200nm的析出物中含有的元素M和Si的原子数比M / Si 铜合金的微观结构平均为0.01〜10，原子数比是通过场放射透射电子显微镜以30,000倍的放大率和能量色散分析仪测量的。 根据本发明，可以提供具有高强度，高导电性和优异弯曲性的铜合金。

    Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRON MATERIAL AND METHOD FOR PRODUCING SAME
    99.
    发明公开
    Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRON MATERIAL AND METHOD FOR PRODUCING SAME 审中-公开
    KUPFERLEGIERUNG AUF CU-NI-SI-CO-BASISFÜREIN ELEKTRONENMATERIAL UND HERSTELLUNGSVERFAHRENDAFÜR

    公开(公告)号：EP2641983A1

    公开(公告)日：2013-09-25

    申请号：EP11848621.6

    申请日：2011-11-11

    申请人： JX Nippon Mining & Metals Corporation

    发明人： KUWAGAKI,Hiroshi

    IPC分类号： C22C9/06 ,  B21B3/00 ,  C22C9/00 ,  C22C9/01 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/10 ,  C22F1/08 ,  H01B1/02 ,  H01B5/02 ,  H01B13/00 ,  C22F1/00

    CPC分类号： H01B1/026 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/06 ,  C22F1/08

    摘要： Cu-Ni-Si-Co copper alloy strip having excellent balance between strength and electrical conductivity which can prevent the drooping curl is provided. The copper alloy strip for an electronic materials contains 1.0-2.5% by mass of Ni, 0.5-2.5% by mass of Co, 0.3-1.2% by mass of Si, and the remainder comprising Cu and unavoidable impurities, wherein the copper alloy strip satisfies both of the following (a) and (b) as determined by means of X-ray diffraction pole figure measurement based on a rolled surface: (a) among a diffraction peak intensities obtained by β scanning at α = 20° in a {200} pole figure, a peak height at β angle 145° is not more than 5.2 times that of standard copper powder; (b) among a diffraction peak intensities obtained by β scanning at α = 75° in a {111} pole figure, a peak height at β angle 185° is not less than 3.4 times that of standard copper powder.

    摘要翻译： 提供了可以防止下垂卷曲的强度和导电性之间具有优异平衡性的Cu-Ni-Si-Co铜合金带。 用于电子材料的铜合金带含有1.0-2.5质量％的Ni，0.5-2.5质量％的Co，0.3-1.2质量％的Si，余量包括Cu和不可避免的杂质，其中铜合金带 满足通过基于轧制表面的X射线衍射极点测量确定的以下（a）和（b）两者：（a）通过在±= 20°的{ 200}极数，峰值角度为145°时不超过标准铜粉的5.2倍; （b）在{111}极图中以±75°扫描获得的衍射峰强度中，角度185°处的峰高不小于标准铜粉的峰值高度的3.4倍。

    COPPER ALLOY SHEET AND MANUFACTURING METHOD FOR SAME
    100.
    发明公开
    COPPER ALLOY SHEET AND MANUFACTURING METHOD FOR SAME 审中-公开
    铜合金板材及其制造方法

    公开(公告)号：EP2610358A1

    公开(公告)日：2013-07-03

    申请号：EP11820069.0

    申请日：2011-08-29

    申请人： Furukawa Electric Co., Ltd.

    发明人： KANEKO, Hiroshi ,  EGUCHI, Tatsuhiko

    IPC分类号： C22C9/00 ,  C22C9/01 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/06 ,  C22C9/10 ,  C22F1/08 ,  H01B1/02 ,  H01R13/03 ,  C22F1/00

    CPC分类号： H01B1/026 ,  C21D2201/05 ,  C22C1/02 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/08 ,  Y02P10/212

    摘要： {Problems} To provide a copper alloy sheet material and a method of producing the same, which is high in Young's modulus and excellent in mechanical strength, and which is suitable for lead frames, connectors, terminal materials, and the like in electrical/electronic equipments, for connectors, for example, to be mounted on automotive vehicles, and for terminal materials, relays, switches, and the like.
    {Means to solve} A copper alloy sheet material, having an alloy composition comprising any one, two, or three of Cr, Zr, and Ti in 0.05 to 1.0 mass% in total, with the balance being copper and unavoidable impurities, wherein, in crystal orientation analysis by EBSD analysis, in connection with accumulation of atomic planes oriented toward the transverse direction (TD) of a rolled sheet, an area ratio of a region having atomic planes in which the angle formed by the normal direction of (111) plane and the TD is 20° or less, is more than 50%; and a method of producing the same.

    摘要翻译： 本发明提供一种铜合金板材及其制造方法，其杨氏模量高，机械强度优异，适用于电气电子用途的引线框，连接器，端子材料等 用于连接器的设备，例如要安装在机动车辆上，以及用于终端材料，继电器，开关等等。 具体实施方式本发明提供一种铜合金板材，其合金组成以合计0.05〜1.0质量％含有Cr，Zr及Ti中的任意1种，2种或3种，其余为铜及不可避免的杂质， 在通过EBSD分析的晶体取向分析中，与朝向轧制板的横向方向（TD）的原子平面的积聚有关的，具有原子平面的区域的面积比率，其中由（111）的法线方向形成的角度， 平面和TD为20°以下，超过50％; 及其制造方法。