公开(公告)号：EP1719397B1

公开(公告)日：2007-07-11

申请号：EP04798024.8

申请日：2004-11-20

Applicant: Rittal GmbH & Co. KG

Inventor： DÖRRICH, Martin ,  NICOLAI, Michael

IPC: H05K7/20 ,  H01L23/473 ,  G06F1/18 ,  G06F1/20

CPC classification number: H05K7/20781 ,  G06F1/181 ,  G06F1/20 ,  G06F2200/201

Abstract: The invention relates to a housing arrangement comprising a receiving housing (10) inside which a cooling device (30) and one or several electric units (40) are accommodated in the interior thereof The cooling device comprises a flow line and a return line (12,13) extending at least partially between the base area and ceiling area of the receiving housing. Connecting lines run from the flow line and return line and are physically connected to a cooling circuit of one or several electric units. Effective cooling of receiving areas which are fitted in a complex manner with built-in components is obtained by virtue of the fact that a distributor line (14) is respectively guided from a flow line and a return line to a distributor (30) which is maintained inside the receiving housing, said distributor comprising several distributor connections, and by virtue of the fact that the distributor connections (31) can be connected to connection lines(42,43) which are guided to the electric built-in component (computer unit).

公开(公告)号：EP1738127A2

公开(公告)日：2007-01-03

申请号：EP05731449.4

申请日：2005-03-23

Applicant: Belits Computer Systems, Inc.

Inventor： BELITS, Alex ,  BELITS, Valeriy

IPC: F28D15/00

CPC classification number: H01L23/427 ,  F28D1/0408 ,  F28D15/0266 ,  F28D15/0275 ,  F28F3/02 ,  F28F3/12 ,  G06F1/20 ,  G06F2200/201 ,  H01L2924/0002 ,  H05K7/20809 ,  H01L2924/00

Abstract: This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.

公开(公告)号：EP1719397A1

公开(公告)日：2006-11-08

申请号：EP04798024.8

申请日：2004-11-20

Applicant: Rittal GmbH & Co. KG

Inventor： DÖRRICH, Martin ,  NICOLAI, Michael

IPC: H05K7/20 ,  H01L23/473 ,  G06F1/18 ,  G06F1/20

CPC classification number: H05K7/20781 ,  G06F1/181 ,  G06F1/20 ,  G06F2200/201

Abstract: The invention relates to a housing arrangement comprising a receiving housing (10) inside which a cooling device (30) and one or several electric units (40) are accommodated in the interior thereof The cooling device comprises a flow line and a return line (12,13) extending at least partially between the base area and ceiling area of the receiving housing. Connecting lines run from the flow line and return line and are physically connected to a cooling circuit of one or several electric units. Effective cooling of receiving areas which are fitted in a complex manner with built-in components is obtained by virtue of the fact that a distributor line (14) is respectively guided from a flow line and a return line to a distributor (30) which is maintained inside the receiving housing, said distributor comprising several distributor connections, and by virtue of the fact that the distributor connections (31) can be connected to connection lines(42,43) which are guided to the electric built-in component (computer unit).

公开(公告)号：EP1693735A2

公开(公告)日：2006-08-23

申请号：EP06100656.5

申请日：2006-01-20

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Tomioka, Kentaro, Toshiba Corp., Int. Prop. Div. ,  Hata, Yukihiko, Toshiba Corp., Int. Prop. Div. ,  Ito, Kenichi, Toshiba Corp., Int. Prop. Div.

IPC: G06F1/20

CPC classification number: G06F1/203 ,  G06F2200/201

Abstract: A cooling device (14) comprises a circulation passage (17) through which a liquid coolant flows, and a pump (15) provided in the circulation passage (17) configured to circulate the liquid coolant along the circulation passage (17). The pump (15) includes, a pump casing (18) including a pump chamber (31) into which the liquid coolant flows, an impeller (35) mounted in the pump chamber (31) to push out the liquid coolant from the pump chamber (31) to the circulation passage (17), and an injection portion (50) provided in the pump casing (18) configured to inject the liquid coolant to the pump chamber (31).

Abstract translation: 一个冷却装置（14）包括一个循环通道（17），液体冷却剂通过该循环通道（17）和一个设置在循环通道（17）中的泵（15），其被构造成沿着循环通道（17）循环液体冷却剂。 泵（15）包括：泵壳体（18），其包括液体冷却剂流入的泵室（31）;安装在泵室（31）中的叶轮（35），以将来自泵室 （31）到所述循环通道（17），以及设置在所述泵壳体（18）中的喷射部分（50），其被配置为将所述液体冷却剂喷射到所述泵室（31）。

公开(公告)号：EP1571534A3

公开(公告)日：2006-07-26

申请号：EP04005453.8

申请日：2004-03-08

Applicant: Hitachi, Ltd.

Inventor： Ohashi, Shigeo c/o Hitachi, Ltd., Intellectual ,  Naganawa, Takashi c/o Hitachi, Ltd., Intellectual ,  Minamitani, Rintaro c/o Hitachi, Ltd.,Intellectual ,  Nishihara, Atsuo c/o Hitachi, Ltd., Intellectual

IPC: G06F1/20

CPC classification number: F28F9/182 ,  F28D1/05333 ,  F28D2021/0029 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20009

Abstract: In an electronic apparatus having a liquid cooling system, and enabling optimal cooling characteristic for capacity with the aid of a radiator, which can be disposed or located fitting in a narrow space within a housing thereof, wherein a CPU (200) in need of cooling is installed within the housing (100), and the liquid cooling system for cooling the CPU comprises a cooling jacket (50) and a radiator therein, wherein the radiator has a pair of headers (62) and (62), being constructed with disposing a large number of metal thin tubes (61,61...) there between, aligned in parallel to each other, and an outer configuration thereof can be changed easily and freely, and therefore it can be positioned even in the narrow space. Further, a cooling fan (64) or (66) for cooling the radiator (60) may be disposed therein, and in that case it is also possible to maintain a position for setting up a motor (65) or (67) for rotationally driving the fan, included therein.

公开(公告)号：EP1671218A2

公开(公告)日：2006-06-21

申请号：EP04785269.4

申请日：2004-09-29

Applicant: INTEL CORPORATION

Inventor： POKHARNA, Himanshu

IPC: G06F1/20

CPC classification number: G06F1/3203 ,  F25B9/002 ,  F25B25/00 ,  F25B27/00 ,  F25B2309/061 ,  F25B2313/0271 ,  G06F1/206 ,  G06F2200/201 ,  Y02D10/16

Abstract: A reversible cooling loop for a notebook computer is described. Specifically, at low power levels, a two-phase fluid cooling loop is implemented to conserve the battery life. At high power levels, a refrigeration loop is implemented.

公开(公告)号：EP1448040A3

公开(公告)日：2006-04-26

申请号：EP04003191.6

申请日：2004-02-12

Applicant: Hitachi, Ltd.

Inventor： Ota, Shigemi, c/o Hitachi, Ltd., Int. Prop. Group ,  Matsushita, Shinji, c/o Hitachi, Ltd.,

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20781 ,  G06F2200/201

Abstract: A rack-mount server system of a liquid cooling system, in which a heat-generating component such as CPU is cooled by a coolant, is composed of: a plurality of server modules with heat-generating components which are cooled by the circulating coolant; a coolant circulation path to which the server modules are connected in parallel and through which the coolant to cool the server modules is circulated; and a cooling unit connected in the middle of the coolant circulation path, the cooling unit circulating the coolant and cooling the coolant by radiating its heat to the outside air. Furthermore, a bypass route parallel to the server modules and going around the server modules is provided in the coolant circulation path, and the circulation quantity of the coolant is controlled in the bypass route. Alternatively, the flow quantity of the coolant is controlled in each of the server modules. In this manner, the cooling enough to ensure the reliability of a plurality of server modules mounted in the rack cabinet can be achieved.

Abstract translation: 其中诸如CPU之类的发热部件由冷却剂冷却的液体冷却系统的机架安装式服务器系统由具有由循环冷却剂冷却的发热部件的多个服务器模块构成; 服务器模块并联连接并冷却服务器模块的冷却剂的冷却剂循环路径被循环; 以及连接在冷却剂循环路径的中间的冷却单元，冷却单元使冷却剂循环，并且通过将冷却剂向外部空气散热来冷却冷却剂。 此外，在冷却剂循环路径中设置有与服务器模块平行并绕过服务器模块的旁路路径，并且在旁路路径中控制冷却剂的循环量。 或者，在每个服务器模块中控制冷却剂的流量。 以这种方式，可以实现足以确保安装在机架柜中的多个服务器模块的可靠性的冷却。

公开(公告)号：EP1577739A2

公开(公告)日：2005-09-21

申请号：EP04005452.0

申请日：2004-03-08

Applicant: Hitachi, Ltd.

Inventor： Suzuki, Osamu c/o Hitachi, Ltd.,Int.Prop. Group

IPC: G06F1/20

CPC classification number: H05K7/20809 ,  F28D15/0233 ,  F28D15/06 ,  F28F13/10 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/345 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic apparatus, such as personal computers of desktop type and notebook type, as well as a server, etc., having a cooling system being high in cooling efficiency, wherein a CPU (200) in need of cooling is installed within a housing (100), and the liquid cooling system for cooling the CPU, comprises: a heat-receiving (cooling) jacket (50); a radiator (60); and a circulation pump (70), wherein the heat-receiving (cooling) jacket (50), for transmitting heat generated from a heat-generation element, i. e., the CPU, into a liquid coolant flowing within an inside thereof, has a heat diffusion plate (90) attached on the lower surface thereof. This heat diffusion plate encloses an operating fluid (94), such as water, within a space, which is hermetically sealed and formed within an inside thereof, and also has heater elements (95), being provided in contact with a portion the operating fluid. To those heater elements (95) are supplied a pulse-like electric power. With this, a portion of the operating fluid repeats forming/extinguishing, to give vibration to the operating fluid, thereby diffusing the heat over the entire of the diffusion plate, thereafter the heat is transmitted to the heat-receiving (cooling) jacket. Or, alternatively, it may be connected with a heat radiation fin (300).

公开(公告)号：EP1411755A3

公开(公告)日：2005-01-19

申请号：EP03019255.3

申请日：2003-08-26

Applicant: Kabushiki Kaisha Toshiba

Inventor： Hisano, Katsumi ,  Takamatsu, Tomonao ,  Tanimoto, Mitsuyoshi ,  Kusaka, Hiroyuki ,  Kinoshita, Teruo , 

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/203 ,  G06F1/1616 ,  G06F1/1681 ,  G06F1/1683 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic apparatus (1) comprises a first housing (4) and a second housing (8). A junction between the first and second housings (4, 8) has three passages (20a, 20b, 20d, 78a, 78c, 78d) that connect an interior of the first housing (4) and an interior of the second housing (8). A cable (60) in which electric signals flow extends through one of the three passages (20b, 78c). Two pipes (57, 58) are provided. The first pipe (57) supplies liquid coolant heated in a heat-receiving portion (33). The second pipe (58) supplies the liquid coolant cooled in a heat-radiating portion (35). The first and second pipes (57, 58) extend through the remaining two of the three passages (20a, 20d, 78a, 78d), respectively.

公开(公告)号：EP1026571A3

公开(公告)日：2004-02-11

申请号：EP99310524.6

申请日：1999-12-23

Applicant: FUJITSU LIMITED

Inventor： Katsui, Tadashi, c/o Fujitsu Limited ,  Takemura, Keizo, c/o Fujitsu Limited ,  Hirano, Minoru, c/o Fujitsu Limited ,  Suzuki, Masumi, c/o Fujitsu Limited ,  Udagawa, Yoshiaki, c/o Fujitsu Limited ,  Ohnishi, Masuo, c/o Fujitsu Limited ,  Fujii, Kenichi, c/o Fujitsu Limited

IPC: G06F1/20

CPC classification number: G06F1/203 ,  G06F1/206 ,  G06F2200/201 ,  Y02D10/16

Abstract: A cooling device (22) for a CPU of a notebook computer comprises a radiation plate (23) and a fin (24) for radiating the heat from the CPU (18). When an external power supply is in use, the CPU is operated at a high clock frequency and the cooling device achieves a high cooling performance by operating a ventilation fan (26) directed to the fin (24), for example. In battery operation of the notebook computer, the CPU is operated at a low clock frequency to reduce power consumption and heat generation, in which case the ventilation fan (26) is not operated. Operation of the fan may be switched by detecting insertion/removal of a power cable, as well as by a temperature sensor and/or by user activation of a "silent" operation mode.