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172 条记录 (耗时 0.015 秒)

    Tantalum capacitor
    101.
    发明公开
    Tantalum capacitor 有权
    钽电容器

    公开(公告)号：EP2104120A2

    公开(公告)日：2009-09-23

    申请号：EP08170147.6

    申请日：2008-11-27

    申请人： Fujitsu Limited

    发明人： Itoh, Masayuki

    IPC分类号： H01G4/38 ,  H01G9/052

    CPC分类号： H01G9/052 ,  H01G2/065 ,  H01G9/0029 ,  H01G9/012 ,  H01G9/15 ,  Y10T29/417 ,  Y10T29/435

    摘要： A tantalum capacitor includes: sintered bodies (110) which are disposed at intervals and respectively have first surfaces forming the same surface; and electrode rods (170) which respectively extend into the tantalum sintered bodies (110) and project from the first surfaces of the tantalum sintered bodies (110). The tantalum capacitor further includes: layers composed of an oxide film layer (120), a functional polymer layer (130) or a manganese layer, and a carbon layer (140) which are sequentially laminated on surfaces of each of the tantalum sintered bodies (110) excluding the first surface; a conductive layer (150) which covers outside surfaces of the tantalum sintered bodies excluding the first surfaces; and an electrode plate (160) having openings respectively formed at positions corresponding to the first surfaces of the tantalum sintered bodies (110) so that the electrode rods (170) are exposed through the openings. The electrode plate (160) is connected to the conductive layer (150) and spreads across the first surfaces of the tantalum sintered bodies (110).

    摘要翻译： 钽电容器包括：间隔设置并分别具有形成相同表面的第一表面的烧结体（110） 和分别延伸到钽烧结体（110）中并从钽烧结体（110）的第一表面突出的电极棒（170）。 钽电容器还包括：由氧化膜层（120），功能聚合物层（130）或锰层和碳层（140）构成的层，所述层依次层叠在每个钽烧结体的表面上 110）不包括第一表面; 覆盖钽烧结体的除了第一表面之外的外表面的导电层（150） 以及在与钽烧结体（110）的第一表面相对应的位置处分别形成有开口的电极板（160），使得电极棒（170）通过开口暴露。 电极板（160）连接到导电层（150）并且横跨钽烧结体（110）的第一表面散布。

    ORIENTATION-INSENSITIVE ULTRA-WIDEBAND COUPLING CAPACITOR AND METHOD OF MAKING
    104.
    发明公开
    ORIENTATION-INSENSITIVE ULTRA-WIDEBAND COUPLING CAPACITOR AND METHOD OF MAKING 审中-公开
    相反的方向敏感的超宽带耦合电容器及方法

    公开(公告)号：EP1800320A2

    公开(公告)日：2007-06-27

    申请号：EP05769004.2

    申请日：2005-07-05

    申请人： Mruz, John

    发明人： Mruz, John

    IPC分类号： H01G4/228

    CPC分类号： H01G2/065 ,  H01G4/005 ,  H01G4/248 ,  H01G4/385 ,  H01G4/40 ,  Y10T29/417 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002

    摘要： An orientation-insensitive ultra-wideband coupling capacitor. The orientation insensitive ultra-wideband coupling capacitor (20) includes a plurality of external surfaces, a low frequency portion, and a high frequency portion. The high frequency portion is so disposed on, and electrically connected to, the low frequency portion so as to allow the orientation-insensitive ultra-wideband coupling capacitor to work identically when mounted on any external longitudinal surface of the plurality of external surfaces thereof and thereby be readily SMT compatible without regard to special orienting procedures.

    Chip capacitor, a fabrication method for the same, and a metal mold
    106.
    发明公开
    Chip capacitor, a fabrication method for the same, and a metal mold 有权
    Chipkondensator，Dessen Herstellungsverfahren und Metallform

    公开(公告)号：EP1143465A3

    公开(公告)日：2006-09-20

    申请号：EP01108617.0

    申请日：2001-04-05

    申请人： Nec Tokin Corporation

    发明人： Sano, Mitsunori ,  Watanabe, Kazunori ,  Sato, Hideaki ,  Mine, Kazuhiro

    IPC分类号： H01G9/012 ,  H01G9/00

    CPC分类号： H01G9/012 ,  H01G2/065

    摘要： The present invention provides a chip capacitor, a fabrication method for the same, and a metal mold that can prevent the occurrence of the chip standing phenomenon even when carrying out soldering using reflow soldering, and that be applied to further down-sizing an decreasing of weight. Curved parts 26 and 36 that extend beyond the connecting tongue pieces 21 and 31 of side piece parts 22 and 23 rising in an upward diagonal direction with respect to the connecting tongue pieces 21 and 31 are formed by press bending processing, and thereby the side piece parts 22 and 32 are exposed in an upward rising direction relative to the connecting tongue pieces 21 and 31 at the external end surfaces 15b and 15c of the external resin packaging.

    摘要翻译： 本发明提供了一种片状电容器及其制造方法，以及即使在使用回流焊接进行焊接的情况下也能够防止芯片立起现象的发生的金属模具，并且适用于进一步减小尺寸 重量。 通过压弯加工形成延伸超过相对于连接舌片21和31向上对角线方向上升的侧片部件22和23的连接舌片21和31的弯曲部分26和36， 部件22和32在外部树脂封装的外端面15b和15c处相对于连接舌片21和31向上升的方向露出。

    Electronic component
    107.
    发明公开
    Electronic component 有权
    Ele。

    公开(公告)号：EP1508905A2

    公开(公告)日：2005-02-23

    申请号：EP04019292.4

    申请日：2004-08-13

    申请人： TDK Corporation

    发明人： Yoshii, Akitoshi ,  Yamamoto, Masanori

    IPC分类号： H01G2/06 ,  H01G4/228

    CPC分类号： H01G2/065 ,  H01G4/228 ,  H01G4/232 ,  H05K3/3426 ,  H05K2201/10651 ,  Y02P70/613

    摘要： An electronic component including:

    an element (2) having a pair of terminal electrodes (11, 12); and a pair of metal terminals (21, 22) formed of metal materials respectively and connected to the pair of terminal electrodes (11, 12) respectively,
    characterized in that:

    a portion of the metal terminal (21, 22) that extends from a base-end side of the metal terminal (21, 22) connectable to an external circuit to face the terminal electrode (11, 12) of the element (2) is an electrode facing portion (21A, 22A); and a tip side portion of the metal terminal (21, 22) in the electrode facing portion (21A, 22A) is connected to the terminal electrode (11, 12), and a gap (S) exists between a base-end side portion of the metal terminal (21, 22) in the electrode facing portion (21A, 22A) and the terminal electrode (11, 12).

    摘要翻译： 一种电子部件，包括：具有一对端子电极（11,12）的元件（2）。 以及分别由金属材料形成并分别连接到所述一对端子电极（11,12）的一对金属端子（21,22），其特征在于：所述金属端子（21,22）的一部分从一个 可连接到外部电路以与元件（2）的端子电极（11,12）相对的金属端子（21,22）的基端侧是电极对向部分（21A，22A）; 所述电极对置部（21A，22A）中的所述金属端子（21,22）的前端部与所述端子电极（11,12）连接，在所述端子侧部分 的电极对置部（21A，22A）和端子电极（11,12）中的金属端子（21,22）。

    SURFACE MOUNTING TYPE ELECTRONIC COMPONENT
    110.
    发明公开
    SURFACE MOUNTING TYPE ELECTRONIC COMPONENT 审中-公开
    ELEKTRONISCHES BAUELEMENT ZUROBERFLÄCHENMONTAGE

    公开(公告)号：EP1289353A1

    公开(公告)日：2003-03-05

    申请号：EP02714512.7

    申请日：2002-04-05

    申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

    发明人： YAMASAKI, Masato ,  ONO, Koji ,  NISHIMOTO, Takumi ,  SATO, Jun

    IPC分类号： H05K1/18 ,  H01C10/00 ,  H01H9/02

    CPC分类号： H01G2/065 ,  H01C1/144 ,  H01H2001/5888 ,  H05K3/3426 ,  Y02P70/613

    摘要： A surface mounted electronic component includes a case and a board mounting part. The board mounting part includes a leg bent in parallel with a printed circuit board at its tip, an outer frame soldered to a land of a mounted part on the board, and a projection disposed in the outer frame and inserted into a hole in the mounted part. The electronic component is mounted on a surface of the printed circuit board in various electronic instruments, and can keep to be mounted on the board tightly even when an external force is applied.

    摘要翻译： 表面安装的电子部件包括壳体和板安装部。 板安装部分包括在其顶端处与印刷电路板平行弯曲的腿部，焊接到板上的安装部分的台面的外框架，以及设置在外框架中的突起并插入到安装件 部分。 电子部件安装在各种电子仪器的印刷电路板的表面上，即使施加外力也能够紧密地安装在基板上。