公开(公告)号：EP4336559B1

公开(公告)日：2024-11-27

申请号：EP23182639.7

申请日：2023-06-30

Inventor： LIM, Hanjin ,  PARK, Jungmin

IPC: H01L29/00 ,  H01G4/008 ,  H01G4/12 ,  H01G4/33 ,  H01G4/40 ,  H01G4/10

公开(公告)号：EP4290542A3

公开(公告)日：2024-09-18

申请号：EP23166806.2

申请日：2023-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： KIM, Jinhong ,  LEE, Changsoo ,  KIM, Cheheung ,  LEE, Jooho ,  CHO, Yong-Hee

IPC: H01G4/10 ,  H01G4/12 ,  H01G4/33 ,  H01G4/40

CPC classification number: H01G4/33 ,  H01G4/40 ,  H01G4/10 ,  H01G4/1218 ,  H01G4/1209 ,  H01L28/56 ,  H01L28/40 ,  H10B12/033 ,  H01L28/90

Abstract: A thin film capacitor (29) including a first thin-film electrode layer (11), a second thin-film electrode layer (13), a dielectric layer (12) between the first and second thin-film electrode layers, and a first interlayer between the first thin-film electrode layer and the dielectric layer and/or between the second thin-film electrode layer and the dielectric layer may be provided. The first interlayer includes a first metal oxide, the first and second thin-film electrode layers (11, 13) includes second metal having a conductive rutile (MO2) crystal structure The dielectric layer (12) includes a third metal oxide having a dielectric rutile crystal structure, and the first metal oxide, the second metal oxide, and third metal oxide have different compositions from each other. The first metal oxide includes GeO2, the third metal oxide includes TiO2, and a thickness of the first interlayer is smaller than that of the dielectric layer. A DRAM comprising the capacitor.

公开(公告)号：EP4423782A2

公开(公告)日：2024-09-04

申请号：EP22888038.1

申请日：2022-10-25

Applicant: Resonant Link, Inc.

Inventor： STEIN, Aaron ,  KYAW, Phyo Aung ,  SULLIVAN, Charles R. ,  KOVACEVIC, Milovan ,  COLLOPY, Caroline

IPC: H01G4/30 ,  H01G4/228 ,  H01G4/40

CPC classification number: H01G4/228 ,  H01G4/40 ,  H01F38/14 ,  H01F27/40 ,  H01F27/2804 ,  H01F2027/280920130101 ,  H05K1/0231

公开(公告)号：EP4411764A2

公开(公告)日：2024-08-07

申请号：EP24151491.8

申请日：2024-01-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： LEE, Jooho ,  CHO, Yong-Hee ,  KIM, Jinhong ,  LEE, Changsoo ,  HEO, Sung

IPC: H01G4/008 ,  H01G4/40 ,  H01G4/012 ,  H01G4/12 ,  H01G4/33 ,  H01L21/02 ,  H10B12/00 ,  H05K1/02

CPC classification number: H05K1/023 ,  H01L28/90 ,  H01L28/91 ,  H01L28/75 ,  H01G4/008 ,  H01G4/012 ,  H01G4/33 ,  H01G4/1218 ,  H01G4/40 ,  H01L21/02194 ,  H10B12/033 ,  H10B12/315

Abstract: Provided are a capacitor, a method of preparing the capacitor, and an electronic device including the capacitor, the capacitor including a lower electrode, an upper electrode spaced apart from the lower electrode, a dielectric between the lower electrode and the upper electrode, a first layer between the lower electrode and the dielectric, and a second layer between the dielectric and the upper electrode, wherein the dielectric comprises TiO2 having a rutile phase and is doped with magnesium, the first layer includes a material having a higher work function than that of a material included in the lower electrode, and the second layer includes a dielectric protective material.

公开(公告)号：EP4396850A1

公开(公告)日：2024-07-10

申请号：EP22865415.8

申请日：2022-08-30

Applicant: Aclara Technologies LLC

Inventor： SANTHANAM, Balaji

IPC: H01G4/38 ,  H01G4/224 ,  H01G4/40 ,  H01G9/26 ,  H01G17/00 ,  H01H33/66 ,  H02H3/13

CPC classification number: Y02E40/30 ,  H02M1/0009 ,  H02M1/42 ,  H02M7/003 ,  H02J3/20 ,  H02J7/345

公开(公告)号：EP3460812B1

公开(公告)日：2024-01-03

申请号：EP17799608.9

申请日：2017-05-15

Inventor： KIM, Gyeong Tae ,  LEE, Myung Ho ,  SEO, Tae Geun ,  HA, Heon Guk ,  HAN, Jae Ho

IPC: H01F17/00 ,  H01F17/04 ,  H01F27/29 ,  H01G2/14 ,  H01G4/40 ,  H03H1/00 ,  H03H7/42 ,  H01F19/04

公开(公告)号：EP3160045B1

公开(公告)日：2023-12-20

申请号：EP15306694.9

申请日：2015-10-22

Inventor： Johler, Werner ,  Difulvio, Philippe

IPC: H03H1/00 ,  H01G4/35 ,  H01G2/22 ,  H02H9/00 ,  H02H9/02 ,  H02H9/04 ,  H01G4/40 ,  H01C13/02

公开(公告)号：EP4216689A3

公开(公告)日：2023-11-08

申请号：EP22216226.5

申请日：2022-12-22

Applicant: Borgwarner Luxembourg Automotive Systems SA

Inventor： David, Pascal ,  Ebenhart, Mark Alan ,  Cipriano, Marc

IPC: H05K7/20 ,  B60L50/50 ,  H01G2/08 ,  H01G4/40 ,  H02M7/00

Abstract: A cooling system for a capacitor (104) comprises a housing (102) for the capacitor (104), the housing (102) comprising of a bottom surface (114), a top surface (116), and at least one side surface connecting the bottom surface (114) and the top surface (116), the housing (102) further including: a bottom inlet manifold (132) and a bottom outlet manifold (133) extending along the bottom surface (114); an inlet side channel (135) extending along the side surface, the inlet side channel (135) being in fluid communication with the bottom inlet manifold (132); an outlet side channel (134) extending along the side surface, the outlet side channel (134) being in fluid communication with the bottom outlet manifold (133); a top inlet manifold (110) extending along the top surface (116), the top inlet manifold (110) being in fluid communication with the inlet side channel (135); and a top outlet manifold (111) extending along the top surface (116), the top outlet manifold (110) being in fluid communication with the outlet side channel (134).

公开(公告)号：EP4216688A3

公开(公告)日：2023-11-01

申请号：EP22216225.7

申请日：2022-12-22

Applicant: Borgwarner Luxembourg Automotive Systems SA

Inventor： David, Pascal ,  Ebenhart, Mark Alan ,  Cipriano, Marc

IPC: H05K7/20 ,  B60L50/50 ,  H01G2/08 ,  H01G4/40 ,  H02M7/00

Abstract: A method of cooling electrical components of a vehicle comprises directing coolant through a capacitor housing (102) into a power module (106) containing one or more inverters. The capacitor housing (102) preferably encloses a capacitor (104), and the capacitor housing (102) is preferably formed substantially of plastic.

公开(公告)号：EP4035193B1

公开(公告)日：2023-11-01

申请号：EP20780637.3

申请日：2020-09-23

Inventor： HAGENAAR, Michel Alexander ,  VRIJSEN, Nilles Henricus ,  TEN HAVE, Roel

IPC: H01G2/06 ,  H01G4/38 ,  H01G4/40 ,  H05K1/18 ,  H05K3/34 ,  H01G4/30