利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

172 条记录 (耗时 0.019 秒)

    MULTILAYER CERAMIC CAPACITOR
    1.
    发明公开
    MULTILAYER CERAMIC CAPACITOR 审中-公开

    公开(公告)号：EP4428882A1

    公开(公告)日：2024-09-11

    申请号：EP24160838.9

    申请日：2024-03-01

    申请人： Samsung Electro-Mechanics Co., Ltd.

    发明人： Yeon, Gyuho ,  Lee, Chaedong ,  Kim, Seung Ah ,  Lee, Chulseung

    IPC分类号： H01G4/248 ,  H01G4/232 ,  H01G4/30 ,  H01G2/06

    CPC分类号： H01G4/232 ,  H01G4/30 ,  H01G4/2325 ,  H01G4/248 ,  H01G2/065

    摘要： A multilayer ceramic capacitor includes a ceramic body having a preset size of length, width, and thickness, first and second external electrodes respectively including body portions covering both end portions spaced apart from each other in a length direction of the ceramic body and band portions extending from the body portions and covering portions of both side surfaces of the ceramic body in a width direction and portions of both side surfaces of the ceramic body in a thickness direction, a plurality of first and second internal electrodes alternately led out from both end portions of the ceramic body with a dielectric layer interposed therebetween and connected to the first and second external electrodes, respectively, and a patterned electrode partially covering one surface of the band portion in the thickness direction of the ceramic body.

    MULTILAYER CAPACITOR, MANUFACTURING METHOD THEREOF, CIRCUIT BOARD, AND ELECTRONIC DEVICE
    4.
    发明公开
    MULTILAYER CAPACITOR, MANUFACTURING METHOD THEREOF, CIRCUIT BOARD, AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP2490233A4

    公开(公告)日：2018-03-21

    申请号：EP10823400

    申请日：2010-10-13

    申请人： RUBYCON CORP

    发明人： TEZUKA TAKENORI ,  ITO CHIHARU ,  KAKO TOMONAO

    IPC分类号： H01G4/30 ,  H01G4/14

    CPC分类号： H01G4/30 ,  H01G2/065 ,  H01G4/145 ,  H01G4/232

    摘要： Provided is a multilayer capacitor that can be manufactured with high yields and whose warpage is suppressed. The multilayer capacitor includes two or more laminated bodies (20A, 20B) which are bonded together, the two or more laminated bodies each including resin layers and metal layers which are alternately laminated a plurality of times in a thickness direction and each being warped and having front and rear surfaces covered with surface layers containing a resin material, one of the front and rear surfaces being formed of a first surface (30) as a smooth surface having no recess portion, another of the front and rear surfaces being formed of a second surface (32) having a recess portion (34), in which at least two adjacent laminated bodies (20A, 20B) are bonded together at the first surfaces (30) or the second surfaces (32). Also provided are a manufacturing method for the multilayer capacitor, and a circuit board and an electronic device which use the multilayer capacitor.