摘要:
A cutting tool formed by a coating layer on a substrate has cutting edges that feature serrations. The linear dimensions of the serrations may vary from a few nanometers up to 10 microns. The serrations result in a smoother cut edge on the workpiece, particularly when the workpiece is formed of certain materials that are seen as particularly difficult to cut, such as hardened steels.
摘要:
A method for forming a stand-alone wafer or a coating on a substrate uses a composite of cubic boron nitride (cBN) particles and other materials, such as nitrides, carbides, carbonitrides, borides, oxides, and metallic phase materials. The wafer or coating may be formed of a thickness up to about 1000 microns for improved wear life. The density of material within the wafer or coating may be varied according to desired parameters, and a gradient of particle sizes for the cBN may be presented across the thickness of the material.
摘要:
A cutting tool formed by a coating layer on a substrate has cutting edges that feature serrations. The linear dimensions of the serrations may vary from a few nanometers up to 10 microns. The serrations result in a smoother cut edge on the workpiece, particularly when the workpiece is formed of certain materials that are seen as particularly difficult to cut, such as hardened steels.
摘要:
A cutting tool formed by a coating layer on a substrate has cutting edges that feature serrations. The linear dimensions of the serrations may vary from a few nanometers up to 10 microns. The serrations result in a smoother cut edge on the workpiece, particularly when the workpiece is formed of certain materials that are seen as particularly difficult to cut, such as hardened steels.