公开(公告)号：EP2707344A1

公开(公告)日：2014-03-19

申请号：EP12786014.6

申请日：2012-05-11

Applicant: BYD Company Limited ,  Shenzhen BYD Auto R&D Company Limited

Inventor： GONG, Qing ,  LIN, Xinping ,  REN, Yongpeng ,  ZHANG, Baoxiang

IPC: C04B41/88 ,  C23C18/16

CPC classification number: H05K3/181 ,  C04B41/009 ,  C04B41/5127 ,  C04B41/88 ,  C04B2111/00844 ,  C23C18/06 ,  C23C18/1245 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1639 ,  H05K1/0306 ,  H05K3/182 ,  H05K3/185 ,  H05K2203/107 ,  Y10T428/24917 ,  C04B35/00 ,  C04B35/04 ,  C04B35/10 ,  C04B35/18 ,  C04B35/19 ,  C04B35/195 ,  C04B35/44 ,  C04B35/48 ,  C04B35/505 ,  C04B35/563 ,  C04B35/565 ,  C04B35/583 ,  C04B35/584 ,  C04B35/597 ,  C04B41/0036 ,  C04B41/4541 ,  C04B41/4572 ,  C04B41/0045 ,  C04B35/185 ,  C04B35/443 ,  C04B35/20

Abstract: A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E is at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.

公开(公告)号：EP3216543B1

公开(公告)日：2020-07-29

申请号：EP15852885.1

申请日：2015-08-28

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  LIN, Xinping ,  LIN, Yongzhao ,  ZHANG, Faliang ,  WU, Bo

IPC: B22D17/00 ,  B22D19/00 ,  B22D19/02 ,  C22C16/00 ,  C22F1/18 ,  C22C1/05 ,  C22C32/00 ,  B22F7/06 ,  B22F7/08 ,  C22C1/10

公开(公告)号：EP3660894A1

公开(公告)日：2020-06-03

申请号：EP18839408.4

申请日：2018-06-29

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  LIN, Xinping ,  XU, Qiang ,  LIU, Chengchen

IPC: H01L23/367 ,  H01L23/373

Abstract: The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body, where the heat conductor is an aluminum-clad ceramic heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the aluminum silicon carbon heat dissipation body is provided with at least one groove; and the aluminum-clad ceramic heat conductor is embedded into the groove through aluminizing in an integral forming manner. The present disclosure further provides a method for manufacturing the foregoing heat dissipation element and an IGBT module including the foregoing heat dissipation element.

公开(公告)号：EP3231781B1

公开(公告)日：2020-01-01

申请号：EP15868073.6

申请日：2015-11-24

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  LIN, Xinping ,  CHEN, Ge ,  LIN, Yongzhao ,  WU, Bo

IPC: C04B35/48 ,  C04B35/622 ,  C04B35/486 ,  C04B35/488 ,  C04B35/632 ,  C04B35/634 ,  C04B35/636

公开(公告)号：EP3383826B1

公开(公告)日：2019-11-06

申请号：EP16869901.5

申请日：2016-11-23

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  LIN, Xinping ,  CHEN, Ge ,  WU, Bo

IPC: C04B35/48 ,  C04B35/622

公开(公告)号：EP3000288B1

公开(公告)日：2019-03-27

申请号：EP14801350.1

申请日：2014-05-21

Applicant: BYD Company Limited

Inventor： XU, Qiang ,  LIN, Xinping

IPC: H05K1/05 ,  H05K3/18 ,  C23C18/16 ,  C23C18/18 ,  C25D11/24 ,  C25D11/08 ,  C25D11/16 ,  C25D11/10 ,  C23C18/40

公开(公告)号：EP3014668A1

公开(公告)日：2016-05-04

申请号：EP14817927.8

申请日：2014-06-24

Applicant: BYD Company Limited

Inventor： LIN, Xinping ,  XU, Qiang

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/54 ,  H01L33/64

CPC classification number: H01L33/641 ,  H01L33/36 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L33/642 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: An LED support assembly and an LED module are provided. The LED support assembly includes: a metal heat sink(10), a first ceramic substrate(20)and a second ceramic substrate(30), the metal heat sink(10)defines an upper surface(11)；the first ceramic substrate(20)is adapted to support a LED chip(40)and disposed on the upper surface(11)of the metal heat sink；the second ceramic substrate(30)is adapted to support electrodes(51,52)of the LED chip(40)and surrounds the first ceramic substrate(20).

公开(公告)号：EP2989067A1

公开(公告)日：2016-03-02

申请号：EP14787406.9

申请日：2014-04-25

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  LIN, Xinping ,  LIN, Yongzhao ,  ZHANG, Faliang ,  CHEN, Jianxin ,  XU, Shurong

IPC: C04B37/02 ,  C04B35/74

CPC classification number: C04B41/5133 ,  B22F7/08 ,  B22F2998/10 ,  C04B35/488 ,  C04B35/71 ,  C04B41/009 ,  C04B41/4515 ,  C04B41/52 ,  C04B41/90 ,  C04B2235/40 ,  C04B2235/404 ,  C04B2235/483 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/606 ,  C04B2235/608 ,  C04B2235/612 ,  C04B2235/616 ,  C04B2235/656 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6581 ,  C22C1/0458 ,  C22C29/06 ,  C22C29/08 ,  C22C29/10 ,  C22C29/12 ,  C22C32/0005 ,  C22C32/0031 ,  C22C32/0052 ,  C04B35/48 ,  C04B38/00 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5057 ,  C04B41/522 ,  C04B41/4523 ,  C04B41/5111 ,  C04B41/5144 ,  C04B41/5155 ,  B22F7/006 ,  B22F2007/066 ,  C22C2001/1057 ,  C22C2001/1073

Abstract: A metal-ceramic composite includes a ceramic substrate and a metallic composite. A groove is formed in a surface of the ceramic substrate and the metallic composite is filled in the groove. The metallic composite includes a Zr based alloy-A composite. A includes at least one selected from a group consisting of W, Mo, Ni, Cr, stainless steel, WC, TiC, SiC, ZrC and ZrO
2 . Based on the total volume of the Zr based alloy-A composite, the content of A is about30％to about70％by volume.A method for preparing the metal-ceramic composite is also provided.

Abstract translation: 金属陶瓷复合体包括陶瓷基体和金属复合体。 在陶瓷基板的表面形成有凹槽，并且金属复合体填充在凹槽中。 金属复合材料包括Zr基合金-A复合材料。 A包括选自W，Mo，Ni，Cr，不锈钢，WC，TiC，SiC，ZrC和ZrO 2中的至少一种。 基于Zr基合金-A复合材料的总体积，A的含量为约30体积％至约70体积％。 还提供了一种制备金属 - 陶瓷复合材料的方法。

公开(公告)号：EP2798687A1

公开(公告)日：2014-11-05

申请号：EP12863032.4

申请日：2012-12-26

Applicant: Shenzhen BYD Auto R&D Company Limited ,  BYD Company Limited

Inventor： GONG, Qing ,  LIN, Xinping ,  ZHANG, Xu ,  LIN, Yongzhao ,  XU, Shurong

IPC: H01M2/08 ,  H01M2/30

CPC classification number: H01M2/08 ,  B23K1/008 ,  B23K1/19 ,  B23K2201/38 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/407 ,  C04B2237/52 ,  H01G9/2077 ,  H01M2/065 ,  H01M2/307 ,  Y10T29/4911

Abstract: A sealing assembly, a method of preparing the sealing assembly and a battery are provided. The sealing assembly comprises a metal ring (1) having a mounting hole therein; a ceramic ring (2) having a connecting hole therein and disposed in the mounting hole; and a core column (3) disposed in the connecting hole, wherein at least one of an inner circumferential wall surface of the metal ring, an outer circumferential wall surface of the ceramic ring, an inner circumferential wall surface of the ceramic ring and an outer circumferential wall surface of the core column is configured as an inclined surface, and an inclination angle of the inclined surface relative to a vertical plane is about 1 degree to about 45 degrees.

公开(公告)号：EP3660895A1

公开(公告)日：2020-06-03

申请号：EP18838105.7

申请日：2018-07-24

Applicant: BYD Company Limited

Inventor： LIU, Chengchen ,  XU, Qiang ,  LIN, Xinping

IPC: H01L23/373

Abstract: The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body; the heat conductor is a ceramic-coated aluminum copper heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the ceramic-coated aluminum copper heat conductor includes a ceramic insulating plate, a copper layer, and a first aluminum layer and a second aluminum layer that are located on two opposite surfaces of the ceramic insulating plate, where the first aluminum layer and the second aluminum layer are isolated by the ceramic insulating plate, and the copper layer is bonded to the ceramic insulating plate by using the second aluminum layer that is integrally formed through aluminizing; the ceramic insulating plate is bonded to the aluminum silicon carbon heat dissipation body by using the first aluminum layer that is integrally formed through aluminizing; and the IGBT module includes the foregoing heat dissipation element.