公开(公告)号：EP4175425A1

公开(公告)日：2023-05-03

申请号：EP21831763.4

申请日：2021-06-28

Applicant: BYD Company Limited

Inventor： ZHOU, Wei ,  XU, Qiang ,  XIE, Caicai

IPC: H05K3/02 ,  C04B37/02

Abstract: A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.

公开(公告)号：EP2999681A1

公开(公告)日：2016-03-30

申请号：EP14801049.9

申请日：2014-05-21

Applicant: BYD Company Limited

Inventor： XU, Qiang ,  LIN, Xinping

IPC: C04B41/85 ,  C04B41/88 ,  C23C18/18 ,  B41M5/24

CPC classification number: B41M5/262 ,  B41M5/24 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/80 ,  C23C14/35 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/38 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/027 ,  C04B35/10 ,  C04B35/48 ,  C04B41/4529 ,  C04B41/455 ,  C04B41/5049 ,  C04B41/5042 ,  C04B41/505 ,  C04B41/0036 ,  C04B41/4541 ,  C04B41/5127 ,  C04B41/5144 ,  C04B41/4564 ,  C04B41/522

Abstract: A method for forming a pattern on a surface of an insulating substrate and a ceramic article comprises: forming a film that comprises any one of ZnO, SnO
2 , TiO
2 and a combination thereof on at least one surface of the insulating substrate; irradiating at least a part of the film by an energy beam to form the pattern in the film.

Abstract translation: 本公开的实施方案涉及用于形成绝缘衬底和/或陶瓷制品的表面上形成图案的方法。 该方法包括：在绝缘基板的至少一个表面上形成的膜，该膜的材料，其包含的ZnO，的SnO 2，TiO 2或它们的组合中的至少一个; 并通过在能量束至少照射膜的一部分以形成在膜中的图案。

公开(公告)号：EP3660894A1

公开(公告)日：2020-06-03

申请号：EP18839408.4

申请日：2018-06-29

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  LIN, Xinping ,  XU, Qiang ,  LIU, Chengchen

IPC: H01L23/367 ,  H01L23/373

Abstract: The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body, where the heat conductor is an aluminum-clad ceramic heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the aluminum silicon carbon heat dissipation body is provided with at least one groove; and the aluminum-clad ceramic heat conductor is embedded into the groove through aluminizing in an integral forming manner. The present disclosure further provides a method for manufacturing the foregoing heat dissipation element and an IGBT module including the foregoing heat dissipation element.

公开(公告)号：EP3000288B1

公开(公告)日：2019-03-27

申请号：EP14801350.1

申请日：2014-05-21

Applicant: BYD Company Limited

Inventor： XU, Qiang ,  LIN, Xinping

IPC: H05K1/05 ,  H05K3/18 ,  C23C18/16 ,  C23C18/18 ,  C25D11/24 ,  C25D11/08 ,  C25D11/16 ,  C25D11/10 ,  C23C18/40

公开(公告)号：EP3014668A1

公开(公告)日：2016-05-04

申请号：EP14817927.8

申请日：2014-06-24

Applicant: BYD Company Limited

Inventor： LIN, Xinping ,  XU, Qiang

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/54 ,  H01L33/64

CPC classification number: H01L33/641 ,  H01L33/36 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L33/642 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: An LED support assembly and an LED module are provided. The LED support assembly includes: a metal heat sink(10), a first ceramic substrate(20)and a second ceramic substrate(30), the metal heat sink(10)defines an upper surface(11)；the first ceramic substrate(20)is adapted to support a LED chip(40)and disposed on the upper surface(11)of the metal heat sink；the second ceramic substrate(30)is adapted to support electrodes(51,52)of the LED chip(40)and surrounds the first ceramic substrate(20).

公开(公告)号：EP3000288A1

公开(公告)日：2016-03-30

申请号：EP14801350.1

申请日：2014-05-21

Applicant: BYD Company Limited

Inventor： XU, Qiang ,  LIN, Xinping

IPC: H05K1/03

CPC classification number: H05K1/053 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/40 ,  C25D11/08 ,  C25D11/10 ,  C25D11/16 ,  C25D11/246 ,  H05K3/185 ,  H05K3/44 ,  H05K2201/0116 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/1147

Abstract: Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.

Abstract translation: 提供了一种电路板及其制造方法。 该电路板包括：铝基衬底; 在铝基基板的至少一个表面上形成的氧化铝层; 以及在氧化铝层上形成的电路层。 氧化铝层包含氧化铝和选自铬，镍，稀土金属及其组合的元素。

公开(公告)号：EP4344818A1

公开(公告)日：2024-04-03

申请号：EP22874796.0

申请日：2022-09-23

Applicant: BYD Company Limited

Inventor： ZHOU, Wei ,  ZHU, Yiming ,  XU, Qiang ,  ZHAO, Wenyan ,  LI, Xiayang

IPC: B23K35/24 ,  B23K35/30 ,  C04B37/02

Abstract: Disclosed are an active metal brazing paste composition, a brazing paste and a method for brazing ceramics and metals. The composition includes a binder and metal powder. The metal powder includes active metal brazing powder and brazing-aid metal powder. The brazing-aid metal powder contains copper powder and/or copper-silver alloy powder. The active metal brazing powder is alloy powder containing copper, silver, and an active metal. With the total weight of the metal powder as a reference, the content of the active metal is 1.5 wt% or more, the content of silver is 40 wt% to 90 wt%, and the content of oxygen is 0.5 wt% or less.

公开(公告)号：EP3660895A1

公开(公告)日：2020-06-03

申请号：EP18838105.7

申请日：2018-07-24

Applicant: BYD Company Limited

Inventor： LIU, Chengchen ,  XU, Qiang ,  LIN, Xinping

IPC: H01L23/373

Abstract: The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body; the heat conductor is a ceramic-coated aluminum copper heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the ceramic-coated aluminum copper heat conductor includes a ceramic insulating plate, a copper layer, and a first aluminum layer and a second aluminum layer that are located on two opposite surfaces of the ceramic insulating plate, where the first aluminum layer and the second aluminum layer are isolated by the ceramic insulating plate, and the copper layer is bonded to the ceramic insulating plate by using the second aluminum layer that is integrally formed through aluminizing; the ceramic insulating plate is bonded to the aluminum silicon carbon heat dissipation body by using the first aluminum layer that is integrally formed through aluminizing; and the IGBT module includes the foregoing heat dissipation element.