利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

29 条记录 (耗时 0.013 秒)

    Heat transfer surface and manufacturing method for same
    13.
    发明公开
    Heat transfer surface and manufacturing method for same 失效
    传热表面和它们的制备方法。

    公开(公告)号：EP0111881A1

    公开(公告)日：1984-06-27

    申请号：EP83112545.5

    申请日：1983-12-13

    申请人： HITACHI, LTD. ,  HITACHI CABLE, LTD.

    发明人： Nakajima, Tadakatsu ,  Nakayama, Wataru ,  Daikoku, Takahiro ,  Kuwahara, Heikichi ,  Yasukawa, Akira ,  Kasuya, Katsuhiko ,  Yokoi, Kazuaki ,  Nakae, Hideo ,  Yoshida, Hiromichi

    IPC分类号： F28F13/18

    CPC分类号： F28F13/187 ,  Y10T29/49378

    摘要： In a heat transfer surface having cavity groups and restricted opening groups in an outer surface region, the cavity groups are composed of a plurality of rows of void strip members. The cavity strip members are arranged in parallel on a base member of the heat transfer surface and are laminated in one or more layers. Each strip member has a number of elongate cavities laterally arranged in parallel. The elongate cavities are closed at upper surfaces and have at both ends openings. The adjacent cavities in the same layer are communicated with each other by communicating portions each provided between the cavity strip members and by the openings. The restricted opening groups are formed on the upper surfaces of the communicating portions. The restricted opening groups render the communicating portions in one layer, the communicating portions in another layer and the outside to communicate with each another. The method of manufacturing such a heat transfer surface is also disclosed.

    Apparatus for cooling integrated circuit chips
    19.
    发明公开
    Apparatus for cooling integrated circuit chips 失效
    Apparat zurKühlungvon integrierten Schaltungschips。

    公开(公告)号：EP0167665A1

    公开(公告)日：1986-01-15

    申请号：EP84114163.3

    申请日：1984-11-23

    申请人： HITACHI, LTD.

    发明人： Nakayama, Wataru ,  Hirasawa, Shigeki ,  Nakajima, Tadakatsu

    IPC分类号： H01L23/42 ,  H05K7/20

    CPC分类号： H05K7/203 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In the boiling type cooling semiconductor chips (2) mounted on printed circuit cards (1), a heat conductive stud (4) is attached to the surface of each chip (2). Cooling plates (3) with fins (6) so arranged to surround the circumference of each stud (4) are placed between the printed circuit cards (1) in order to condense the vapor bubbles produced near the studs (4).

    摘要翻译： 在安装在印刷电路卡（1）上的沸腾型冷却半导体芯片（2）中，在每个芯片（2）的表面上安装导热柱（4）。 将布置成围绕每个螺柱（4）的圆周的散热片（6）的冷却板（3）放置在印刷电路板（1）之间，以冷凝在螺柱（4）附近产生的蒸气泡。