公开(公告)号：EP0237741B1

公开(公告)日：1992-05-13

申请号：EP87101348.8

申请日：1987-02-02

申请人： HITACHI, LTD.

发明人： Nakajima, Tadakatsu 7-301 Tsukuba House ,  Nakayama, Wataru ,  Oohashi, Shigeo Niihari-ryo ,  Kuwabara, Heikichi ,  Daikoku, Takahiro

IPC分类号： H01L23/42 ,  H01L23/36

CPC分类号： H01L23/433 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10S165/907

公开(公告)号：EP0237741A2

公开(公告)日：1987-09-23

申请号：EP87101348.8

申请日：1987-02-02

申请人： HITACHI, LTD.

发明人： Nakajima, Tadakatsu 7-301 Tsukuba House ,  Nakayama, Wataru ,  Oohashi, Shigeo Niihari-ryo ,  Kuwabara, Heikichi ,  Daikoku, Takahiro

IPC分类号： H01L23/42 ,  H01L23/36

CPC分类号： H01L23/433 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10S165/907

摘要： The present invention relates to a thermal conduction device well suited to cool electronic components such as semiconductor devices, in which a porous layer (11) is provided at the surface part of the contact interface of a heat generating element (1) or a heat sink element (2), and a liquid (13) such as oil is contained in cavities (15) formed in the porous layer (11), the heat generating element (1) and the heat sink element (2) being held in close contact by the surface tension of the liquid (13), whereby heat generated by the heat generating element (1) is transferred to the heat sink element (2).